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Excepting OEM PCB, i.e. Telecommunication, PC Add-On Card, IT Application, Network Device, Multi Layers FR-4 product, we have some outstanding products as follows:

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PCB Powerpole® Family Tooling OMNIMATE Power PCB terminals
PCB terminals - OMNIMATE Power

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PADS PCB Design Tools

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PADS DS Suite
PCB layout considerations for non-isolated switching power supplies
Henry J. Zhang, Applications Engineering Manager, Power Products, Linear Technology Corp. - July 20, 2012
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Introduction
The best news when you power up a prototype supply board for the very first time is when it not only works, but also runs quiet and cool. Unfortunately, this does not always happen.
A common problem of switching power supplies is "unstable" switching waveforms. Sometimes, waveform jittering is so pronounced that audible noise can be heard from the magnetic components. If the problem is related to the printed circuit board (PCB) layout, identifying the cause can be difficult. This is why proper PCB layout at the early stage of a switching supply design is very critical. Its importance cannot be overstated.
The power supply designer is the person who best understands the technical details and functional requirements of the supply within the final product. He or she should work closely with the PCB layout designer on the critical supply layout from the beginning.Power Management DesignLine
Design Article



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mdavismarsh
8/27/2010 11:09 AM EDT
Solder wicking is definitly a problem when the size of a via increases.
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hm
8/23/2010 10:25 AM EDT
I always liked NSC application notes as continuing education tools and this ...
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PCB layout techniques to maximize power module performance
Don Rhodes and Marc Davis-Marsh, National Semiconductor Corp.
8/22/2010 9:55 PM EDT
A new class of easy-to-use power modules offers an alternative to complex power designs and the printed circuit board (PCB) layout issues typically related to DC-DC converters. Nonetheless, there is still some engineering to be done when designing with and laying out these power modules, which integrate an inductor and a monolithic synchronous regulator within one power package. Re PCB design I have these MOSFETs to drive a motor: STB180N55F3
PADS PowerPCB
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Pads (also called leg guards) are protective equipment used by batters in the sports of cricket and baseball, and by goaltenders in hockey, bandy and lacrosse. They serve to protect the legs from impact by a hard ball or puck at high speed which could otherwise cause injuries to the lower leg. In cricket, pads fall into two types, batting pads and…
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I am going to make a double sided PCB and was wary about Track widths re power disipation.
Based on the motor running full there is a possiblity to run at 50Amps.
This is a fair amount over a PCB.

Has anyone ever designed a board using this dsort of current.
Supply Voltage is 12Vdc.

The datasheet gives a foot print guide but I really feel the trach or surface area is to be around 50mm.
Correct me if I'm mistaken.

The MOSFET is suited to high current with heatsinking.

As mentioned any feedback based on PCB copper layout would be greatly appreciated.
This article describes the best PCB layout methods, practices and techniques to maximize the SIMPLE SWITCHER power module’s performance. It also discuses relevant thermal issues, and its lessons apply to other power-supply designs, as well.
The article is presented as a pdf file (no registration required); to read it, click here.
About the Authors
Don Rhodes is a field applications engineer with National Semiconductor Corp., and is based in Tigard, Oregon. He received his BSE degree from Chapman University.
Marc Davis-Marsh is an applications engineer with National Semiconductor Corp., Santa Clara, Calif. He holds an MSEE and BSEE from Wright State University, Dayton, Ohio
A good layout design optimizes supply efficiency, alleviates thermal stress, and most importantly, minimizes the noise and interactions among traces and components. To achieve these, it is important for the designer to understand the current conduction paths and signal flows in the switching power supply. The following discussion presents design considerations for a proper layout design for non-isolated switching power supplies. Matrox G400/450 Bug when doing part name displays on NT
mitered pads
Split/Mixed vs Copper Pour
Wish list for PowerPCB Ver 4
Innoveda links and info for contacting support
Netlist compare ignores non-ECO parts connected to a net
PowerLogic/PowerPCB compare causes crash
PowerLogic Snap to Grid not snapping
New part type, decal is not automatically assigned
The Decal Editor and color assignments
Zero Width DCODEs with flooded over pads
DFF Audit errors
Synchronizing PCB to LOGIC and Alternate Decals
Rats nest lines stay on planes when useing "flood over"
ECOGEN, non-registered parts, Clusters/unions
Soldermask not showing up (versions prior to V4)
Parts and testpoints
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4.0 Export then inport error
Net not staying with pin, PowerLogic
Copper Circles/Arcs in RS-274-X
Space violation checking in 4.0
Default Colors for Decal Editor
Holes/vias in SMT pads
Layer Associations
color scheme simplification
Split/Mixed Planes
double_qoute synch. problem
color scheme again
Start Files and printing
Layer Assignments
Arc BUG
Capture netlist to PowerPCB
4.01 ??
problems in PPCB 4.0 and CAM350 v 7.0
Part Outlines
PowerPCB V4.01 Is Here
Teal key and 3.5.1 PowerPCB Install
Definitions of poured, non-poured, hatch and flood?
Problem with "Lines" to save to Library
Board outline
"No Current Signal Tree" error message?
Importing a netlist for a manual design already in progress.
VB Script need to produce Parts List
Spilt/mixed plane
pcbstandards library?
PLAN OF THE LAYOUT
Location of the Power Supply in System Board
For the embedded DC/DC supply on a large system board, the supply output should be located close to the load devices in order to minimize the interconnection impedance and the conduction voltage drop across the PCB traces to achieve best voltage regulation, load transient response and system efficiency. If forced-air cooling is available, the supply should also be located close to the cooling fan or have good air flow to limit the thermal stress.


Ideal for the Electrical Design Engineer looking for rapid product definition. Includes Design / Constraint Definition, Advanced Component Search & Verification, and Variant Design. Learn more

PADS LS Suite

Designed for the Layout Designer who wants to quickly define and complete PCB designs. Design Definition, PCB Layout, Auto-routing, and 3D Viewing are included. Learn more

PADS ES Suite

Created for Engineers who want complete product definition within a single solution and Layout Designers who need high-speed routing capabilities. Contains the PADS DS & LS Suites plus Analog Simulation, SI Analy

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25 amp
Drawings (+)
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Definitions
jointly valid document for all datasheets Definitions Document
PE Power PCB Relay PE 1 pole 5 A DC-coil Datasheet
PE bistable Power PCB Relay PE bistable 1 pole 5 A bistable Datasheet
REL Miniature PCB Relay REL 1 pole 5 A DC-coil Datasheet
RE Miniature PCB Relay RE 1 pole 6 A DC-coil Datasheet
PCH /
PCH-WG Miniature Power PCB Relay PCH 1 pole 5 A DC-coil Datasheet
OJ Miniature PCB Relay OJ 1 pole 8 A DC-coil Datasheet

2. Thin PCB: Less than 16 mil thickness in 4 or 6 layers FR-4 production is another challenge for our production capability. From raw material control, producing inner conductor to lamination, we have to develop many tools to handle the interior materials that are thin as paper. Those materials are mostly used in PC CARDs and some MEMORY CARD, such as the MEMORY STICK, COMPACT FLASH etc. We had produced over 200,000 pieces monthly for Flash Card or Flash Card Reader device in past. The performance is resulting from our outstanding board thickness control and thin PCB process.

3. CSP // BGA PCB: Because the chipset supports high frequency, many requires BGA package, i.e. AGP card, DDR 400 etc. We understand that it is not only for surface flatness, but also for filling VIA holes. Those kinds of PCB are increasing and we expect the quantity will be over 10% of our production in coming years.


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