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PCB Manufacturer,PCB Factory line,PCB Production Equipment/Facility

PCBSINO PCB Process Capability
 
 
 
Parameter name
Unit
Capability
1
surface
 
Lead-free HAL, the whole board gold, ENIG, OSP, Immersion Tin, Immersion Silver, gold plated
2
Copper peel strength
N/cm
7.8
3
Flame-retardant
 
94V-0
4
Inner processing
 
Brown of
5
Minimum thickness of the inner plate
mm
0.05
6
Drill hole (maximum)
mm
6.3
7
Insulation thickness (minimum)
mm
0.075 (limit HOZ bottom copper)
8
Impedance tolerance
%
±5Ω(<50Ω),±10%(≥50Ω);≥50Ω can be±5%
9
Ion contamination
ug/cm2
≤1
10
Rogers Material type
 
Ro4350,Ro4350B,Ro4003,Ro4003C,Ro3003,RT5880
11
Taconic material type
 
RF-35,TLX-8,TLC-32
12
Halogen-plate type (normal Tg)
 
SY S1155, S0155 prepreg
13
High Tg Laminate type
 
SY 170℃ High Tg
14
Pressing blind buried via multiple production
 
Pressing the same side≤3 times
15
Circuit board layers
Layer
2005/1/28
16
Copper
um
12、18、35、70
17
FR-4 prepreg
 
7,628,211,610,803,310,000
18
Rogers prepreg
 
Ro4403(0.10mm),Ro4450B(0.10mm),
19
Material mixed with pressure
 
Rogers/Taconic/Arlon and FR-4
20
Solder mask color
 
Green, yellow, black, blue, red, white, green matt
21
Character ink colors
 
White, yellow, black
22
Groove cutter diameter of the smallest
mm
0.6
23
Drilling than the maximum thickness
 
20:1 (excluding ≤ 0.2mm radius, need assessment is greater than 12:1)
24
Hole tolerance (compared with the CAD data)
mil
±3
25
Minimum width of the inner wire (18um based copper, before compensation)
mil
3
26
Minimum width of the inner wire (35um based copper, before compensation)
mil
3
27
Minimum width of the inner wire (70um based copper, before compensation)
mil
4
28
Minimum width of the outer conductor (12,18 um based copper, before compensation)
mil
4(18um),3(12um)
29
Minimum width of the outer conductors (35um based copper, before compensation)
mil
4.5
30
Minimum width of the outer conductors (70um based copper, before compensation)
mil
6
31
Minimum line to the outer disk, disk to disk space (after compensation)
mil
3 (12,18 um) k can be partially 2.5,3.5 (35um), 5 (70um), 6 (105,140 um)
32
Minimum mesh width
mil
5 (12,18,35 um), 10 (70 um)
33
Minimum grid spacing
mil
5 (12,18,35 um), 8 (70 um)
34
Minimum pad diameter
mil
12 (0.10mm Mechanical or laser drilling)
35
Maximum dry film sealing slot
 
5mm * 3.0mm; sealing unilateral than 15mil
36
Diameter of dry film sealing
mm
4.5
37
Minimum width of sealing unilateral dry
mil
10
38
Outer minimum width through-hole pad unilateral
mil
4 (12,18 um) can be partially 3.5,4.5 (35um), 6 (70um), 8 (105um), 10 (140um)
39
BGA pad diameter of the smallest
mil
10 (water, gold plate 7mil)
40
Drilling into the lead body from the smallest (non-buried blind plate)
mil
6 (≤ 8 layers), 8 (≤ 12 layers), 10 (≤ 28 layers)
41
Inner isolation ring width (unilateral) minimum
mil
8 (≤ 6-layer), 10 (≥ 8 layer) may be partially cut plate 8
42
Minimum width of the inner pad unilateral
mil
5 (18,35 um, can be partially 4.5), 6 (70um), 8 (105um)
43
Minimum bandwidth of the inner isolation
mil
8
44
Copper inner plate edges do not drain the minimum distance
mil
10
45
Minimum width etched logo
mil
8 (12,18 um), 10 (35um), 12 (70um)
46
Inner and outer completed the largest copper thickness
 
5OZ (175um)
47
Finished copper thickness (18um base copper)
um
≥ 35 (typical value of 52um, which 1.5OZ)
48
Finished copper thickness (35um base copper)
um
≥55
49
Finished copper thickness (70um base copper)
um
≥90
50
Maximum height of finger
inch
2
51
Nickel Nickel whole plate thickness
um
2005/3/5
52
Jin Jin the whole plate thickness of nickel
um
0.025-0.10
53
Nickel Nickel Immersion Gold Thickness
um
2005/3/5
54
Immersion nickel gold gold thickness
um
0.025-0.10
55
Nickel-plated nickel-thick gold finger
um
2005/3/5
56
Jin Jin finger thick nickel
um
0.25-1.3 (required value refers to the thinnest point;> 0.76 to be reviewed)
57
Hole copper thickness at the thinnest
um
Average of 25, minimum single points of ≥ 20
58
Free hole diameter precision welding device
mil
± 2
59
HAL solder / pure tin thickness of the thinnest
um
0.4 (surface of a large tin)
60
Green oil minimum unilateral fenestration (clearance degrees)
mil
2 (the local water board gold 1.5, other local board 1)
61
Green oil plug hole drilling diameter
mm
0.65
62
Green oil cap unilateral minimum line width
mil
2.5 (allowing local 2mil)
63
Green oil window width of the smallest word
mil
8
64
Minimum thickness of the green oil
um
10
65
The thickness of the oil hole cover
um
2005/5/8
66
Minimum separation of oil and carbon pad
mil
8
67
Blue plastic cover line or pad unilateral minimum
mil
2
68
Minimum width of solder bridge
mil
4 (green), 5 (other colors) (bottom copper ≤ 1OZ) (bottom copper 2-4OZ, all according to 6mil)
69
Solder hardness
H
6
70
Blue Gum and the minimum separation pad
mil
12
71
Blue and white plastic mesh plug hole diameter
mm
2
72
Blue rubber thickness
mm
0.2-0.5
73
Character width and height of the smallest (12,18 um based copper)
 
trace Width 4mil; height: 25mil
74
Character width and height of the smallest (35um base copper)
 
trace Width 5mil; height: 30mil
75
Character width and height of the smallest (70um base copper)
 
trace Width 6mil; height: 45mil
76
Characters with the minimum isolation pad
mil
6
77
Maximum finished size of double-sided
inch
23 * 35 (long side needs assessment beyond the 30inch)
78
Thickness
mm
0.13-7.0 (thickness ≤ 0.5mm when the make-up ≤ 18in)
79
Thickness Tolerance (≤ 1.0mm)
mm
± 0.1
80
Thickness Tolerance (> 1.0mm)
mm
Thickness ± 10%
81
Special thickness tolerances (no layer structure requirements)
mm
≤ 2.0 board ± 0.1; 2.0-3.0 board ± 0.15; ≥ 3.0 ± 0.2 board
82
Mode shape
 
Milling shape; V-CUT; bridged; Post Standard hole
83
Overall minimum diameter cutter
mm
0.8
84
Dimension accuracy (edge to edge)
mil
± 4 (complex shape, with this requirement within the tank needs assessment)
85
V-CUT point specifications
 
20°,30°,45°,60°
86
V-CUT point of tolerance
o
±5°
87
V-CUT symmetry tolerance
mil
±4
88
V-CUT tendon thickness tolerances
mil
±4
89
Minimum spacing between the finger
mil
6
90
TAB does not hurt the next finger down the minimum distance
mm
7(Refers to the automatic chamfering)
91
Finger chamfer angle tolerance
 
±5°
92
Finger thickness tolerances than chamfer
mil
±5
93
Radius of the smallest interior angle
mm
0.4
94
Warpage limit the ability
%
0.1 (≤ 0.3 to be reviewed)
95
PTH slot minimum tolerance
mm
±0.15
96
Completion of the minimum plate
mm
10*10
97
Pitch board edge minimum distance test
mm
0.5
98
Minimum resistance test
Ω
10
99
Maximum insulation resistance test
100
100
Maximum test voltage
V
250
101
Minimum test pad
mil
3.9
102
Minimum distance between the test pad
mil
3.9
103
The maximum test current
mA
200
104
Thickness limit resistance test hole
mm
0.38-5.0
105
Resistance test hole diameter limit
mm
min: 0.62mm, max Heavy 0.25mm than the test plate board
106
Carbon-carbon oil and minimum oil separation
mil
12
107
Unilateral minimum carbon oil cap line
mil
2
108
EXCELLON rig
two processing capacity
0.05-7.0mm,max 18.5*30inch
109
HITACHI rig
two processing capacity
0.05-7.0mm,max 27.2*21.0inch
110
Milling
two processing capacity
0.05-7.0mm,max 25.5*21.5inch
111
Photoplotter
 
max 32*26inch
112
Exposure red chip
 
max 35*28inch
113
LDI Exposure
largest board 26*32in
0.05-5.0mm,max 21*29inch
114
Red film developing machine
 
Not more than 19.7inch unilateral
115
Nickel gold graphics
 
0.4-3.2mm,max 17*18inch
116
Deburring brushing machine
 
0.50-7.0mm,min 8*8inch
117
Inner and outer line brushing machine
 
0.10-4.0mm,min 9*9inch
118
Screen printing machine grinding plate
 
0.50-7.0mm,min:9*9inch
119
A second copper plating line
 
0.10-7.0mm,max 24*90inch
120
In addition to plastic PTH
two processing capacity
0.10-7.0mm,max 24*32in
121
Hitachi automatic packing machine
 
0.10-3.2mm,min 8*8in,max 24*24in
122
DES line
 
0.10-7.0mm,max 7*7inch
123
PE punching machine
 
0.08-0.8mm,min 12*16inch;max 24*28inch
124
Horizontal Brown of the line
 
0.10-1.6mm,min 10*10inch
125
X-RAY drill drone
 
0.3-7.0mm,min 12*14in;max 24*30in
126
SES line
 
0.10-7.0mm,max 7*7inch
127
ORC Exposure
 
0.05-7.0mm,max 32*24inch
128
Fine Arts Exposure
 
0.05-3.2mm,max 18*24inch
129
CSUN Exposure
 
0.05-7.0mm,max 25*32inch
130
SK-75E AOI machine
two processing capacity
0.05-6.0mm,max 23.5*23.5inch
131
VRS machine
two processing capacity
0.05-6.0mm,max 23.5*23.5inch
132
Solder developing machine
 
0.4-7.0mm,min 4*5inch
133
Laminating machine
MASS LAM mathod
0.075-7.0mm,max 27*32inch
134
HAL line before and after treatment
 
0.4-4.0mm,min 7*7inch
135
Hot Air Leveling Machine
two processing capacity
0.6-4.0mm,min 5*5;max 20*25inch
136
EMMA tester
 
0.4-7.0mm,max 30*24;min 3*3inch
137
Four-pin fx
 
0.4-6.0mm,max 19.6*23.5inch
138
MV-300 test machine
 
0.4-3.0mm,max 24*28inch
139
V-CUT machine
<0.8mm only single board
0.6-3.0mm, v-cut line perpendicular to the edge of not more than 18inch
140
Line processing
customer supply
min 8 * 8inch
141
Finger plating line
 
0.8-2.0mm, either side of a row of non-board side of the finger to a distance of ≤ 8inch board
142
Arlon plate type
 
AD350,AR1000,25FR,33N,Diclad527
143
Maximum thickness of 0.20mm drills
mm
2.5
144
Even the smallest hole diameter
mm
0.45
145
Copper inner yin and yang
 
18/35, 35/70 (18/70 and does not meet the requirements of a need to review compensation etching)
146
The outer layer of copper foil of yin and yang
 
18/35 (35/70, 18/70 and does not meet the requirements of a need to review compensation etching)
147
Impedance control panel plate type
 
FR-4, FR-4 halogen, FR-4 High Tg, RO4000, 25FR Series
148
Minimum width of the outer conductor (105um based copper, before compensation)
mil
8
149
Minimum distance between the outer conductor (12,18 um based copper, after compensation)
mil
3.0(18um),2.5(12um)
150
Minimum distance between the outer conductors (35um based copper, after compensation)
mil
3.5
151
Minimum distance between the outer conductors (70um based copper, after compensation)
mil
5
152
Minimum distance between the outer conductor (105um based copper, after compensation)
mil
6
153
Minimum width of the inner conductor (105um based copper, before compensation)
mil
5
154
Minimum distance between the inner conductor (18um based copper, after compensation)
mil
3
155
Minimum distance between the inner conductor (35um based copper, after compensation)
mil
3.5
156
Minimum distance between the inner conductor (70um based copper, after compensation)
mil
4
157
Minimum distance between the inner conductor (105um based copper, after compensation)
mil
5
158
Body to guide the minimum drilling distance (blind buried plate)
mil
9 (a lamination); 10 (Pressing two or three times)
159
Blue rubber plug hole diameter aluminum
mm
4.5
160
Maximum finished size four-layer board
inch
22.5 * 33.5 (out of 30inch long side to be reviewed)
161
Six and above the maximum board size of the finished product
inch
22.5 * 26.5 (22.5inch long side than to be reviewed)
162
Milling the outer shape of the minimum distance is not exposed copper
mil
8
163
V-CUT does not leak to the graphics from the centerline of copper (H ≤ 1.0mm)
mm
0.3(20°),0.33(30°),0.37(45°),0.42(60°)
164
V-CUT does not leak to the graphics from the centerline of copper (1.0 <H ≤ 1.6mm)
mm
0.36(20°),0.4(30°),0.5(45°),0.6(60°)
165
V-CUT does not leak to the graphics from the centerline of copper (1.6 <H ≤ 2.4mm)
mm
0.42(20°),0.51(30°),0.64(45°),0.8(60°)
166
V-CUT does not leak to the graphics from the centerline of copper (2.5 ≤ H ≤ 3.0mm)
mm
0.47(20°),0.59(30°),0.77(45°),0.97(60°)
167
NPTH minimum hole diameter tolerance
mm
± 2 (the limit +0, -0.05 or +0.05, -0)
168
Length of the finger surface
 
Water, gold / Immersion Gold; hard gold plating
169
The second element
 
max 24*28inch
170
Immersion gold
 
0.2-7.0mm,min 6*6in,max 21*27in
171
High-frequency board make-up the maximum size (rogers, arlon, tyconic full range, high frequency board Jiangsu Taixing, providing high-frequency board)
inch
16*18
172
Taconic prepreg type
 
TP-32(0.10mm)
173
0.15mm maximum thickness mechanical drilling
mm
1.20(≤8 layer)
174
0.10mm maximum thickness mechanical drilling
mm
0.60(≤6 layer)
175
Minimum aperture of laser drilling
mm
0.10 (depth ≤ 55um), 0.13 (depth ≤ 100um)
176
HDI board types
 
1 + n +1,1 +1 + n +1 +1,2 + n +2 (n in order to be buried vias ≤ 0.3,2 comment)
177
Minimum inner channel
 
3 (18um base copper), 4 (35um base copper), ≥ 3 channel
178
Minimum width of the outer conductor (140um based copper, before compensation)
mil
9
179
Minimum distance between the outer conductor (140um based copper, after compensation)
mil
7
180
Minimum width of the inner conductor (140um based copper, before compensation)
mil
7
181
Minimum distance between the inner conductor (140um based copper, after compensation)
mil
7
182
Ladder hole
 
PTH and NPTH, large hole angle 130 degrees, a large hole diameter less than 6.3mm
183
RCC material
 
Copper foil 12, the resin 65,80,100 um (after lamination 55,70,90 um)
184
Immersion tin tin thickness
um
0.8-1.5
185
Immersion silver silver thick
um
0.1-0.3
186
Hard gold plating gold thickness
um
0.15-1.3
187
Angle and size of the speaker hole
 
Macroporous 82,90,120 degree, diameter ≤ 10mm
188
Halogen-free plate type (high Tg)
 
SY S1165, PP for the S0165
189
Selective surface treatment
 
ENIG + OSP, ENIG + G / F, spray the whole board gold + tin, full plate gilt + G / F, Shen silver + G / F, Shen tin + G / F
190
Bonding machine capacity
 
0.5-6.0mm,max 24*32in,min 14*16in
191
Ability of the finished product washing machine
 
0.2-5.0mm,max 24*24in,min 4*4in
192
Collimated Exposure Machine
 
0.05-3.0mm,min 16*21in,max 22*25in
193
Milling depth control tank (side) or blind slot precision (NPTH)
mm
±0.10