PCB capability

  • PCB capability file

    • 　
      Parameter name
      Unit
      Capability
      1
      surface
      		 　
      Lead-free HAL, the whole board gold, ENIG, OSP, Immersion Tin, Immersion Silver, gold plated
      2
      Copper peel strength
      N/cm
      7.8
      3
      Flame-retardant
      		 　
      94V-0
      4
      Inner processing
      		 　
      Brown of
      5
      Minimum thickness of the inner plate
      mm
      0.05
      6
      Drill hole (maximum)
      mm
      6.3
      7
      Insulation thickness (minimum)
      mm
      0.075 (limit HOZ bottom copper)
      8
      Impedance tolerance
      %
      ±5Ω(<50Ω),±10%(≥50Ω);≥50Ω can be±5%
      9
      Ion contamination
      ug/cm2
      ≤1
      10
      Rogers Material type
      		 　
      Ro4350,Ro4350B,Ro4003,Ro4003C,Ro3003,RT5880
      11
      Taconic material type
      		 　
      RF-35,TLX-8,TLC-32
      12
      Halogen-plate type (normal Tg)
      		 　
      SY S1155, S0155 prepreg
      13
      High Tg Laminate type
      		 　
      SY 170℃ High Tg
      14
      Pressing blind buried via multiple production
      		 　
      Pressing the same side≤3 times
      15
      Circuit board layers
      Layer
      2005/1/28
      16
      Copper
      um
      12、18、35、70
      17
      FR-4 prepreg
      		 　
      7,628,211,610,803,310,000
      18
      Rogers prepreg
      		 　
      Ro4403(0.10mm),Ro4450B(0.10mm),
      19
      Material mixed with pressure
      		 　
      Rogers/Taconic/Arlon and FR-4
      20
      Solder mask color
      		 　
      Green, yellow, black, blue, red, white, green matt
      21
      Character ink colors
      		 　
      White, yellow, black
      22
      Groove cutter diameter of the smallest
      mm
      0.6
      23
      Drilling than the maximum thickness
      		 　
      20:1 (excluding ≤ 0.2mm radius, need assessment is greater than 12:1)
      24
      Hole tolerance (compared with the CAD data)
      mil
      ±3
      25
      Minimum width of the inner wire (18um based copper, before compensation)
      mil
      3
      26
      Minimum width of the inner wire (35um based copper, before compensation)
      mil
      3
      27
      Minimum width of the inner wire (70um based copper, before compensation)
      mil
      4
      28
      Minimum width of the outer conductor (12,18 um based copper, before compensation)
      mil
      4(18um),3(12um)
      29
      Minimum width of the outer conductors (35um based copper, before compensation)
      mil
      4.5
      30
      Minimum width of the outer conductors (70um based copper, before compensation)
      mil
      6
      31
      Minimum line to the outer disk, disk to disk space (after compensation)
      mil
      3 (12,18 um) k can be partially 2.5,3.5 (35um), 5 (70um), 6 (105,140 um)
      32
      Minimum mesh width
      mil
      5 (12,18,35 um), 10 (70 um)
      33
      Minimum grid spacing
      mil
      5 (12,18,35 um), 8 (70 um)
      34
      Minimum pad diameter
      mil
      12 (0.10mm Mechanical or laser drilling)
      35
      Maximum dry film sealing slot
      		 　
      5mm * 3.0mm; sealing unilateral than 15mil
      36
      Diameter of dry film sealing
      mm
      4.5
      37
      Minimum width of sealing unilateral dry
      mil
      10
      38
      Outer minimum width through-hole pad unilateral
      mil
      4 (12,18 um) can be partially 3.5,4.5 (35um), 6 (70um), 8 (105um), 10 (140um)
      39
      BGA pad diameter of the smallest
      mil
      10 (water, gold plate 7mil)
      40
      Drilling into the lead body from the smallest (non-buried blind plate)
      mil
      6 (≤ 8 layers), 8 (≤ 12 layers), 10 (≤ 28 layers)
      41
      Inner isolation ring width (unilateral) minimum
      mil
      8 (≤ 6-layer), 10 (≥ 8 layer) may be partially cut plate 8
      42
      Minimum width of the inner pad unilateral
      mil
      5 (18,35 um, can be partially 4.5), 6 (70um), 8 (105um)
      43
      Minimum bandwidth of the inner isolation
      mil
      8
      44
      Copper inner plate edges do not drain the minimum distance
      mil
      10
      45
      Minimum width etched logo
      mil
      8 (12,18 um), 10 (35um), 12 (70um)
      46
      Inner and outer completed the largest copper thickness
      		 　
      5OZ (175um)
      47
      Finished copper thickness (18um base copper)
      um
      ≥ 35 (typical value of 52um, which 1.5OZ)
      48
      Finished copper thickness (35um base copper)
      um
      ≥55
      49
      Finished copper thickness (70um base copper)
      um
      ≥90
      50
      Maximum height of finger
      inch
      2
      51
      Nickel Nickel whole plate thickness
      um
      2005/3/5
      52
      Jin Jin the whole plate thickness of nickel
      um
      0.025-0.10
      53
      Nickel Nickel Immersion Gold Thickness
      um
      2005/3/5
      54
      Immersion nickel gold gold thickness
      um
      0.025-0.10
      55
      Nickel-plated nickel-thick gold finger
      um
      2005/3/5
      56
      Jin Jin finger thick nickel
      um
      0.25-1.3 (required value refers to the thinnest point;> 0.76 to be reviewed)
      57
      Hole copper thickness at the thinnest
      um
      Average of 25, minimum single points of ≥ 20
      58
      Free hole diameter precision welding device
      mil
      ± 2
      59
      HAL solder / pure tin thickness of the thinnest
      um
      0.4 (surface of a large tin)
      60
      Green oil minimum unilateral fenestration (clearance degrees)
      mil
      2 (the local water board gold 1.5, other local board 1)
      61
      Green oil plug hole drilling diameter
      mm
      0.65
      62
      Green oil cap unilateral minimum line width
      mil
      2.5 (allowing local 2mil)
      63
      Green oil window width of the smallest word
      mil
      8
      64
      Minimum thickness of the green oil
      um
      10
      65
      The thickness of the oil hole cover
      um
      2005/5/8
      66
      Minimum separation of oil and carbon pad
      mil
      8
      67
      Blue plastic cover line or pad unilateral minimum
      mil
      2
      68
      Minimum width of solder bridge
      mil
      4 (green), 5 (other colors) (bottom copper ≤ 1OZ) (bottom copper 2-4OZ, all according to 6mil)
      69
      Solder hardness
      H
      6
      70
      Blue Gum and the minimum separation pad
      mil
      12
      71
      Blue and white plastic mesh plug hole diameter
      mm
      2
      72
      Blue rubber thickness
      mm
      0.2-0.5
      73
      Character width and height of the smallest (12,18 um based copper)
      		 　
      trace Width 4mil; height: 25mil
      74
      Character width and height of the smallest (35um base copper)
      		 　
      trace Width 5mil; height: 30mil
      75
      Character width and height of the smallest (70um base copper)
      		 　
      trace Width 6mil; height: 45mil
      76
      Characters with the minimum isolation pad
      mil
      6
      77
      Maximum finished size of double-sided
      inch
      23 * 35 (long side needs assessment beyond the 30inch)
      78
      Thickness
      mm
      0.13-7.0 (thickness ≤ 0.5mm when the make-up ≤ 18in)
      79
      Thickness Tolerance (≤ 1.0mm)
      mm
      ± 0.1
      80
      Thickness Tolerance (> 1.0mm)
      mm
      Thickness ± 10%
      81
      Special thickness tolerances (no layer structure requirements)
      mm
      ≤ 2.0 board ± 0.1; 2.0-3.0 board ± 0.15; ≥ 3.0 ± 0.2 board
      82
      Mode shape
      		 　
      Milling shape; V-CUT; bridged; Post Standard hole
      83
      Overall minimum diameter cutter
      mm
      0.8
      84
      Dimension accuracy (edge to edge)
      mil
      ± 4 (complex shape, with this requirement within the tank needs assessment)
      85
      V-CUT point specifications
      		 　
      20°，30°，45°,60°
      86
      V-CUT point of tolerance
      o
      ±5°
      87
      V-CUT symmetry tolerance
      mil
      ±4
      88
      V-CUT tendon thickness tolerances
      mil
      ±4
      89
      Minimum spacing between the finger
      mil
      6
      90
      TAB does not hurt the next finger down the minimum distance
      mm
      7(Refers to the automatic chamfering)
      91
      Finger chamfer angle tolerance
      		 　
      ±5°
      92
      Finger thickness tolerances than chamfer
      mil
      ±5
      93
      Radius of the smallest interior angle
      mm
      0.4
      94
      Warpage limit the ability
      %
      0.1 (≤ 0.3 to be reviewed)
      95
      PTH slot minimum tolerance
      mm
      ±0.15
      96
      Completion of the minimum plate
      mm
      10*10
      97
      Pitch board edge minimum distance test
      mm
      0.5
      98
      Minimum resistance test
      Ω
      10
      99
      Maximum insulation resistance test
      MΩ
      100
      100
      Maximum test voltage
      V
      250
      101
      Minimum test pad
      mil
      3.9
      102
      Minimum distance between the test pad
      mil
      3.9
      103
      The maximum test current
      mA
      200
      104
      Thickness limit resistance test hole
      mm
      0.38-5.0
      105
      Resistance test hole diameter limit
      mm
      min: 0.62mm, max Heavy 0.25mm than the test plate board
      106
      Carbon-carbon oil and minimum oil separation
      mil
      12
      107
      Unilateral minimum carbon oil cap line
      mil
      2
      108
      EXCELLON rig
      two processing capacity
      0.05-7.0mm，max 18.5*30inch
      109
      HITACHI rig
      two processing capacity
      0.05-7.0mm，max 27.2*21.0inch
      110
      Milling
      two processing capacity
      0.05-7.0mm,max 25.5*21.5inch
      111
      Photoplotter
      		 　
      max 32*26inch
      112
      Exposure red chip
      		 　
      max 35*28inch
      113
      LDI Exposure
      largest board 26*32in
      0.05-5.0mm,max 21*29inch
      114
      Red film developing machine
      		 　
      Not more than 19.7inch unilateral
      115
      Nickel gold graphics
      		 　
      0.4-3.2mm,max 17*18inch
      116
      Deburring brushing machine
      		 　
      0.50-7.0mm,min 8*8inch
      117
      Inner and outer line brushing machine
      		 　
      0.10-4.0mm,min 9*9inch
      118
      Screen printing machine grinding plate
      		 　
      0.50-7.0mm,min：9*9inch
      119
      A second copper plating line
      		 　
      0.10-7.0mm,max 24*90inch
      120
      In addition to plastic PTH
      two processing capacity
      0.10-7.0mm,max 24*32in
      121
      Hitachi automatic packing machine
      		 　
      0.10-3.2mm,min 8*8in,max 24*24in
      122
      DES line
      		 　
      0.10-7.0mm,max 7*7inch
      123
      PE punching machine
      		 　
      0.08-0.8mm,min 12*16inch；max 24*28inch
      124
      Horizontal Brown of the line
      		 　
      0.10-1.6mm,min 10*10inch
      125
      X-RAY drill drone
      		 　
      0.3-7.0mm,min 12*14in；max 24*30in
      126
      SES line
      		 　
      0.10-7.0mm,max 7*7inch
      127
      ORC Exposure
      		 　
      0.05-7.0mm,max 32*24inch
      128
      Fine Arts Exposure
      		 　
      0.05-3.2mm,max 18*24inch
      129
      CSUN Exposure
      		 　
      0.05-7.0mm,max 25*32inch
      130
      SK-75E AOI machine
      two processing capacity
      0.05-6.0mm,max 23.5*23.5inch
      131
      VRS machine
      two processing capacity
      0.05-6.0mm,max 23.5*23.5inch
      132
      Solder developing machine
      		 　
      0.4-7.0mm,min 4*5inch
      133
      Laminating machine
      MASS LAM mathod
      0.075-7.0mm,max 27*32inch
      134
      HAL line before and after treatment
      		 　
      0.4-4.0mm,min 7*7inch
      135
      Hot Air Leveling Machine
      two processing capacity
      0.6-4.0mm,min 5*5；max 20*25inch
      136
      EMMA tester
      		 　
      0.4-7.0mm,max 30*24；min 3*3inch
      137
      Four-pin fx
      		 　
      0.4-6.0mm,max 19.6*23.5inch
      138
      MV-300 test machine
      		 　
      0.4-3.0mm,max 24*28inch
      139
      V-CUT machine
      <0.8mm only single board
      0.6-3.0mm, v-cut line perpendicular to the edge of not more than 18inch
      140
      Line processing
      customer supply
      min 8 * 8inch
      141
      Finger plating line
      		 　
      0.8-2.0mm, either side of a row of non-board side of the finger to a distance of ≤ 8inch board
      142
      Arlon plate type
      		 　
      AD350,AR1000,25FR,33N,Diclad527
      143
      Maximum thickness of 0.20mm drills
      mm
      2.5
      144
      Even the smallest hole diameter
      mm
      0.45
      145
      Copper inner yin and yang
      		 　
      18/35, 35/70 (18/70 and does not meet the requirements of a need to review compensation etching)
      146
      The outer layer of copper foil of yin and yang
      		 　
      18/35 (35/70, 18/70 and does not meet the requirements of a need to review compensation etching)
      147
      Impedance control panel plate type
      		 　
      FR-4, FR-4 halogen, FR-4 High Tg, RO4000, 25FR Series
      148
      Minimum width of the outer conductor (105um based copper, before compensation)
      mil
      8
      149
      Minimum distance between the outer conductor (12,18 um based copper, after compensation)
      mil
      3.0(18um),2.5(12um)
      150
      Minimum distance between the outer conductors (35um based copper, after compensation)
      mil
      3.5
      151
      Minimum distance between the outer conductors (70um based copper, after compensation)
      mil
      5
      152
      Minimum distance between the outer conductor (105um based copper, after compensation)
      mil
      6
      153
      Minimum width of the inner conductor (105um based copper, before compensation)
      mil
      5
      154
      Minimum distance between the inner conductor (18um based copper, after compensation)
      mil
      3
      155
      Minimum distance between the inner conductor (35um based copper, after compensation)
      mil
      3.5
      156
      Minimum distance between the inner conductor (70um based copper, after compensation)
      mil
      4
      157
      Minimum distance between the inner conductor (105um based copper, after compensation)
      mil
      5
      158
      Body to guide the minimum drilling distance (blind buried plate)
      mil
      9 (a lamination); 10 (Pressing two or three times)
      159
      Blue rubber plug hole diameter aluminum
      mm
      4.5
      160
      Maximum finished size four-layer board
      inch
      22.5 * 33.5 (out of 30inch long side to be reviewed)
      161
      Six and above the maximum board size of the finished product
      inch
      22.5 * 26.5 (22.5inch long side than to be reviewed)
      162
      Milling the outer shape of the minimum distance is not exposed copper
      mil
      8
      163
      V-CUT does not leak to the graphics from the centerline of copper (H ≤ 1.0mm)
      mm
      0.3(20°),0.33(30°),0.37(45°),0.42(60°)
      164
      V-CUT does not leak to the graphics from the centerline of copper (1.0 <H ≤ 1.6mm)
      mm
      0.36(20°),0.4(30°),0.5(45°),0.6(60°)
      165
      V-CUT does not leak to the graphics from the centerline of copper (1.6 <H ≤ 2.4mm)
      mm
      0.42(20°),0.51(30°),0.64(45°),0.8(60°)
      166
      V-CUT does not leak to the graphics from the centerline of copper (2.5 ≤ H ≤ 3.0mm)
      mm
      0.47(20°),0.59(30°),0.77(45°),0.97(60°)
      167
      NPTH minimum hole diameter tolerance
      mm
      ± 2 (the limit +0, -0.05 or +0.05, -0)
      168
      Length of the finger surface
      		 　
      Water, gold / Immersion Gold; hard gold plating
      169
      The second element
      		 　
      max 24*28inch
      170
      Immersion gold
      		 　
      0.2-7.0mm，min 6*6in，max 21*27in
      171
      High-frequency board make-up the maximum size (rogers, arlon, tyconic full range, high frequency board Jiangsu Taixing, providing high-frequency board)
      inch
      16*18
      172
      Taconic prepreg type
      		 　
      TP-32（0.10mm）
      173
      0.15mm maximum thickness mechanical drilling
      mm
      1.20(≤8 layer)
      174
      0.10mm maximum thickness mechanical drilling
      mm
      0.60(≤6 layer)
      175
      Minimum aperture of laser drilling
      mm
      0.10 (depth ≤ 55um), 0.13 (depth ≤ 100um)
      176
      HDI board types
      		 　
      1 + n +1,1 +1 + n +1 +1,2 + n +2 (n in order to be buried vias ≤ 0.3,2 comment)
      177
      Minimum inner channel
      		 　
      3 (18um base copper), 4 (35um base copper), ≥ 3 channel
      178
      Minimum width of the outer conductor (140um based copper, before compensation)
      mil
      9
      179
      Minimum distance between the outer conductor (140um based copper, after compensation)
      mil
      7
      180
      Minimum width of the inner conductor (140um based copper, before compensation)
      mil
      7
      181
      Minimum distance between the inner conductor (140um based copper, after compensation)
      mil
      7
      182
      Ladder hole
      		 　
      PTH and NPTH, large hole angle 130 degrees, a large hole diameter less than 6.3mm
      183
      RCC material
      		 　
      Copper foil 12, the resin 65,80,100 um (after lamination 55,70,90 um)
      184
      Immersion tin tin thickness
      um
      0.8-1.5
      185
      Immersion silver silver thick
      um
      0.1-0.3
      186
      Hard gold plating gold thickness
      um
      0.15-1.3
      187
      Angle and size of the speaker hole
      		 　
      Macroporous 82,90,120 degree, diameter ≤ 10mm
      188
      Halogen-free plate type (high Tg)
      		 　
      SY S1165, PP for the S0165
      189
      Selective surface treatment
      		 　
      ENIG + OSP, ENIG + G / F, spray the whole board gold + tin, full plate gilt + G / F, Shen silver + G / F, Shen tin + G / F
      190
      Bonding machine capacity
      		 　
      0.5-6.0mm，max 24*32in，min 14*16in
      191
      Ability of the finished product washing machine
      		 　
      0.2-5.0mm，max 24*24in，min 4*4in
      192
      Collimated Exposure Machine
      		 　
      0.05-3.0mm，min 16*21in，max 22*25in
      193
      Milling depth control tank (side) or blind slot precision (NPTH)
      mm
      ±0.10
      Note: this capacity is top capability


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