Products include large and thick HDI boards and also high density thin stacked microvia constructions.
Improves the performance of products because of high integration
Makes it easier to automate the assembly of PCBs
Reduces total costs
Standard or First Generation Microvias
Create routing density (eliminate through vias)
Reduce layer count
Enhance electrical characteristics
Drilling the smallest of micro-vias allows for more technology on the board's surface. Using a beam of light 20 microns (1 Mil) in diameter, this high influence beam can cut through metal and glass creating the tiny via hole.
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