PCB capabilities, Electronic Manufacturing PCB Assembly Services China

PCB capability file

	Parameter name	Unit	Capability
1	surface		Lead-free HAL, the whole board gold, ENIG, OSP, Immersion Tin, Immersion Silver, gold plated
2	Copper peel strength	N/cm	7.8
3	Flame-retardant		94V-0
4	Inner processing		Brown of
5	Minimum thickness of the inner plate	mm	0.05
6	Drill hole (maximum)	mm	6.3
7	Insulation thickness (minimum)	mm	0.075 (limit HOZ bottom copper)
8	Impedance tolerance	%	±5Ω(<50Ω),±10%(≥50Ω);≥50Ω can be±5%
9	Ion contamination	ug/cm2	≤1
10	Rogers Material type		Ro4350,Ro4350B,Ro4003,Ro4003C,Ro3003,RT5880
11	Taconic material type		RF-35,TLX-8,TLC-32
12	Halogen-plate type (normal Tg)		SY S1155, S0155 prepreg
13	High Tg Laminate type		SY 170℃ High Tg
14	Pressing blind buried via multiple production		Pressing the same side≤3 times
15	Circuit board layers	Layer	2005/1/28
16	Copper	um	12、18、35、70
17	FR-4 prepreg		7,628,211,610,803,310,000
18	Rogers prepreg		Ro4403(0.10mm),Ro4450B(0.10mm),
19	Material mixed with pressure		Rogers/Taconic/Arlon and FR-4
20	Solder mask color		Green, yellow, black, blue, red, white, green matt
21	Character ink colors		White, yellow, black
22	Groove cutter diameter of the smallest	mm	0.6
23	Drilling than the maximum thickness		20:1 (excluding ≤ 0.2mm radius, need assessment is greater than 12:1)
24	Hole tolerance (compared with the CAD data)	mil	±3
25	Minimum width of the inner wire (18um based copper, before compensation)	mil	3
26	Minimum width of the inner wire (35um based copper, before compensation)	mil	3
27	Minimum width of the inner wire (70um based copper, before compensation)	mil	4
28	Minimum width of the outer conductor (12,18 um based copper, before compensation)	mil	4(18um),3(12um)
29	Minimum width of the outer conductors (35um based copper, before compensation)	mil	4.5
30	Minimum width of the outer conductors (70um based copper, before compensation)	mil	6
31	Minimum line to the outer disk, disk to disk space (after compensation)	mil	3 (12,18 um) k can be partially 2.5,3.5 (35um), 5 (70um), 6 (105,140 um)
32	Minimum mesh width	mil	5 (12,18,35 um), 10 (70 um)
33	Minimum grid spacing	mil	5 (12,18,35 um), 8 (70 um)
34	Minimum pad diameter	mil	12 (0.10mm Mechanical or laser drilling)
35	Maximum dry film sealing slot		5mm * 3.0mm; sealing unilateral than 15mil
36	Diameter of dry film sealing	mm	4.5
37	Minimum width of sealing unilateral dry	mil	10
38	Outer minimum width through-hole pad unilateral	mil	4 (12,18 um) can be partially 3.5,4.5 (35um), 6 (70um), 8 (105um), 10 (140um)
39	BGA pad diameter of the smallest	mil	10 (water, gold plate 7mil)
40	Drilling into the lead body from the smallest (non-buried blind plate)	mil	6 (≤ 8 layers), 8 (≤ 12 layers), 10 (≤ 28 layers)
41	Inner isolation ring width (unilateral) minimum	mil	8 (≤ 6-layer), 10 (≥ 8 layer) may be partially cut plate 8
42	Minimum width of the inner pad unilateral	mil	5 (18,35 um, can be partially 4.5), 6 (70um), 8 (105um)
43	Minimum bandwidth of the inner isolation	mil	8
44	Copper inner plate edges do not drain the minimum distance	mil	10
45	Minimum width etched logo	mil	8 (12,18 um), 10 (35um), 12 (70um)
46	Inner and outer completed the largest copper thickness		5OZ (175um)
47	Finished copper thickness (18um base copper)	um	≥ 35 (typical value of 52um, which 1.5OZ)
48	Finished copper thickness (35um base copper)	um	≥55
49	Finished copper thickness (70um base copper)	um	≥90
50	Maximum height of finger	inch	2
51	Nickel Nickel whole plate thickness	um	2005/3/5
52	Jin Jin the whole plate thickness of nickel	um	0.025-0.10
53	Nickel Nickel Immersion Gold Thickness	um	2005/3/5
54	Immersion nickel gold gold thickness	um	0.025-0.10
55	Nickel-plated nickel-thick gold finger	um	2005/3/5
56	Jin Jin finger thick nickel	um	0.25-1.3 (required value refers to the thinnest point;> 0.76 to be reviewed)
57	Hole copper thickness at the thinnest	um	Average of 25, minimum single points of ≥ 20
58	Free hole diameter precision welding device	mil	± 2
59	HAL solder / pure tin thickness of the thinnest	um	0.4 (surface of a large tin)
60	Green oil minimum unilateral fenestration (clearance degrees)	mil	2 (the local water board gold 1.5, other local board 1)
61	Green oil plug hole drilling diameter	mm	0.65
62	Green oil cap unilateral minimum line width	mil	2.5 (allowing local 2mil)
63	Green oil window width of the smallest word	mil	8
64	Minimum thickness of the green oil	um	10
65	The thickness of the oil hole cover	um	2005/5/8
66	Minimum separation of oil and carbon pad	mil	8
67	Blue plastic cover line or pad unilateral minimum	mil	2
68	Minimum width of solder bridge	mil	4 (green), 5 (other colors) (bottom copper ≤ 1OZ) (bottom copper 2-4OZ, all according to 6mil)
69	Solder hardness	H	6
70	Blue Gum and the minimum separation pad	mil	12
71	Blue and white plastic mesh plug hole diameter	mm	2
72	Blue rubber thickness	mm	0.2-0.5
73	Character width and height of the smallest (12,18 um based copper)		trace Width 4mil; height: 25mil
74	Character width and height of the smallest (35um base copper)		trace Width 5mil; height: 30mil
75	Character width and height of the smallest (70um base copper)		trace Width 6mil; height: 45mil
76	Characters with the minimum isolation pad	mil	6
77	Maximum finished size of double-sided	inch	23 * 35 (long side needs assessment beyond the 30inch)
78	Thickness	mm	0.13-7.0 (thickness ≤ 0.5mm when the make-up ≤ 18in)
79	Thickness Tolerance (≤ 1.0mm)	mm	± 0.1
80	Thickness Tolerance (> 1.0mm)	mm	Thickness ± 10%
81	Special thickness tolerances (no layer structure requirements)	mm	≤ 2.0 board ± 0.1; 2.0-3.0 board ± 0.15; ≥ 3.0 ± 0.2 board
82	Mode shape		Milling shape; V-CUT; bridged; Post Standard hole
83	Overall minimum diameter cutter	mm	0.8
84	Dimension accuracy (edge to edge)	mil	± 4 (complex shape, with this requirement within the tank needs assessment)
85	V-CUT point specifications		20°，30°，45°,60°
86	V-CUT point of tolerance	o	±5°
87	V-CUT symmetry tolerance	mil	±4
88	V-CUT tendon thickness tolerances	mil	±4
89	Minimum spacing between the finger	mil	6
90	TAB does not hurt the next finger down the minimum distance	mm	7(Refers to the automatic chamfering)
91	Finger chamfer angle tolerance		±5°
92	Finger thickness tolerances than chamfer	mil	±5
93	Radius of the smallest interior angle	mm	0.4
94	Warpage limit the ability	%	0.1 (≤ 0.3 to be reviewed)
95	PTH slot minimum tolerance	mm	±0.15
96	Completion of the minimum plate	mm	10*10
97	Pitch board edge minimum distance test	mm	0.5
98	Minimum resistance test	Ω	10
99	Maximum insulation resistance test	MΩ	100
100	Maximum test voltage	V	250
101	Minimum test pad	mil	3.9
102	Minimum distance between the test pad	mil	3.9
103	The maximum test current	mA	200
104	Thickness limit resistance test hole	mm	0.38-5.0
105	Resistance test hole diameter limit	mm	min: 0.62mm, max Heavy 0.25mm than the test plate board
106	Carbon-carbon oil and minimum oil separation	mil	12
107	Unilateral minimum carbon oil cap line	mil	2
108	EXCELLON rig	two processing capacity	0.05-7.0mm，max 18.5*30inch
109	HITACHI rig	two processing capacity	0.05-7.0mm，max 27.2*21.0inch
110	Milling	two processing capacity	0.05-7.0mm,max 25.5*21.5inch
111	Photoplotter		max 32*26inch
112	Exposure red chip		max 35*28inch
113	LDI Exposure	largest board 26*32in	0.05-5.0mm,max 21*29inch
114	Red film developing machine		Not more than 19.7inch unilateral
115	Nickel gold graphics		0.4-3.2mm,max 17*18inch
116	Deburring brushing machine		0.50-7.0mm,min 8*8inch
117	Inner and outer line brushing machine		0.10-4.0mm,min 9*9inch
118	Screen printing machine grinding plate		0.50-7.0mm,min：9*9inch
119	A second copper plating line		0.10-7.0mm,max 24*90inch
120	In addition to plastic PTH	two processing capacity	0.10-7.0mm,max 24*32in
121	Hitachi automatic packing machine		0.10-3.2mm,min 88in,max 2424in
122	DES line		0.10-7.0mm,max 7*7inch
123	PE punching machine		0.08-0.8mm,min 1216inch；max 2428inch
124	Horizontal Brown of the line		0.10-1.6mm,min 10*10inch
125	X-RAY drill drone		0.3-7.0mm,min 1214in；max 2430in
126	SES line		0.10-7.0mm,max 7*7inch
127	ORC Exposure		0.05-7.0mm,max 32*24inch
128	Fine Arts Exposure		0.05-3.2mm,max 18*24inch
129	CSUN Exposure		0.05-7.0mm,max 25*32inch
130	SK-75E AOI machine	two processing capacity	0.05-6.0mm,max 23.5*23.5inch
131	VRS machine	two processing capacity	0.05-6.0mm,max 23.5*23.5inch
132	Solder developing machine		0.4-7.0mm,min 4*5inch
133	Laminating machine	MASS LAM mathod	0.075-7.0mm,max 27*32inch
134	HAL line before and after treatment		0.4-4.0mm,min 7*7inch
135	Hot Air Leveling Machine	two processing capacity	0.6-4.0mm,min 55；max 2025inch
136	EMMA tester		0.4-7.0mm,max 3024；min 33inch
137	Four-pin fx		0.4-6.0mm,max 19.6*23.5inch
138	MV-300 test machine		0.4-3.0mm,max 24*28inch
139	V-CUT machine	<0.8mm only single board	0.6-3.0mm, v-cut line perpendicular to the edge of not more than 18inch
140	Line processing	customer supply	min 8 * 8inch
141	Finger plating line		0.8-2.0mm, either side of a row of non-board side of the finger to a distance of ≤ 8inch board
142	Arlon plate type		AD350,AR1000,25FR,33N,Diclad527
143	Maximum thickness of 0.20mm drills	mm	2.5
144	Even the smallest hole diameter	mm	0.45
145	Copper inner yin and yang		18/35, 35/70 (18/70 and does not meet the requirements of a need to review compensation etching)
146	The outer layer of copper foil of yin and yang		18/35 (35/70, 18/70 and does not meet the requirements of a need to review compensation etching)
147	Impedance control panel plate type		FR-4, FR-4 halogen, FR-4 High Tg, RO4000, 25FR Series
148	Minimum width of the outer conductor (105um based copper, before compensation)	mil	8
149	Minimum distance between the outer conductor (12,18 um based copper, after compensation)	mil	3.0(18um),2.5(12um)
150	Minimum distance between the outer conductors (35um based copper, after compensation)	mil	3.5
151	Minimum distance between the outer conductors (70um based copper, after compensation)	mil	5
152	Minimum distance between the outer conductor (105um based copper, after compensation)	mil	6
153	Minimum width of the inner conductor (105um based copper, before compensation)	mil	5
154	Minimum distance between the inner conductor (18um based copper, after compensation)	mil	3
155	Minimum distance between the inner conductor (35um based copper, after compensation)	mil	3.5
156	Minimum distance between the inner conductor (70um based copper, after compensation)	mil	4
157	Minimum distance between the inner conductor (105um based copper, after compensation)	mil	5
158	Body to guide the minimum drilling distance (blind buried plate)	mil	9 (a lamination); 10 (Pressing two or three times)
159	Blue rubber plug hole diameter aluminum	mm	4.5
160	Maximum finished size four-layer board	inch	22.5 * 33.5 (out of 30inch long side to be reviewed)
161	Six and above the maximum board size of the finished product	inch	22.5 * 26.5 (22.5inch long side than to be reviewed)
162	Milling the outer shape of the minimum distance is not exposed copper	mil	8
163	V-CUT does not leak to the graphics from the centerline of copper (H ≤ 1.0mm)	mm	0.3(20°),0.33(30°),0.37(45°),0.42(60°)
164	V-CUT does not leak to the graphics from the centerline of copper (1.0 <H ≤ 1.6mm)	mm	0.36(20°),0.4(30°),0.5(45°),0.6(60°)
165	V-CUT does not leak to the graphics from the centerline of copper (1.6 <H ≤ 2.4mm)	mm	0.42(20°),0.51(30°),0.64(45°),0.8(60°)
166	V-CUT does not leak to the graphics from the centerline of copper (2.5 ≤ H ≤ 3.0mm)	mm	0.47(20°),0.59(30°),0.77(45°),0.97(60°)
167	NPTH minimum hole diameter tolerance	mm	± 2 (the limit +0, -0.05 or +0.05, -0)
168	Length of the finger surface		Water, gold / Immersion Gold; hard gold plating
169	The second element		max 24*28inch
170	Immersion gold		0.2-7.0mm，min 66in，max 2127in
171	High-frequency board make-up the maximum size (rogers, arlon, tyconic full range, high frequency board Jiangsu Taixing, providing high-frequency board)	inch	16*18
172	Taconic prepreg type		TP-32（0.10mm）
173	0.15mm maximum thickness mechanical drilling	mm	1.20(≤8 layer)
174	0.10mm maximum thickness mechanical drilling	mm	0.60(≤6 layer)
175	Minimum aperture of laser drilling	mm	0.10 (depth ≤ 55um), 0.13 (depth ≤ 100um)
176	HDI board types		1 + n +1,1 +1 + n +1 +1,2 + n +2 (n in order to be buried vias ≤ 0.3,2 comment)
177	Minimum inner channel		3 (18um base copper), 4 (35um base copper), ≥ 3 channel
178	Minimum width of the outer conductor (140um based copper, before compensation)	mil	9
179	Minimum distance between the outer conductor (140um based copper, after compensation)	mil	7
180	Minimum width of the inner conductor (140um based copper, before compensation)	mil	7
181	Minimum distance between the inner conductor (140um based copper, after compensation)	mil	7
182	Ladder hole		PTH and NPTH, large hole angle 130 degrees, a large hole diameter less than 6.3mm
183	RCC material		Copper foil 12, the resin 65,80,100 um (after lamination 55,70,90 um)
184	Immersion tin tin thickness	um	0.8-1.5
185	Immersion silver silver thick	um	0.1-0.3
186	Hard gold plating gold thickness	um	0.15-1.3
187	Angle and size of the speaker hole		Macroporous 82,90,120 degree, diameter ≤ 10mm
188	Halogen-free plate type (high Tg)		SY S1165, PP for the S0165
189	Selective surface treatment		ENIG + OSP, ENIG + G / F, spray the whole board gold + tin, full plate gilt + G / F, Shen silver + G / F, Shen tin + G / F
190	Bonding machine capacity		0.5-6.0mm，max 2432in，min 1416in
191	Ability of the finished product washing machine		0.2-5.0mm，max 2424in，min 44in
192	Collimated Exposure Machine		0.05-3.0mm，min 1621in，max 2225in
193	Milling depth control tank (side) or blind slot precision (NPTH)	mm	±0.10

Note: this capacity is top capability
like trace to trace distance, top capability is 3 mil, but normally we design at 4-7mil
via hole diameter can make 0.1mm diameter, but we design normally at 0.2mm
for prototype with top capability PCB design layout, no any problem;
for mass production, if your design layout base on top capability will lead to high cost PCB
when design layout, make design tolerance a bit more larger than our top capability can drop PCB cost.

PCBSINO PCB manufacturing capabilities:

PCB capability file