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Micro pitch connector Flex PCB application

Micro pitch connector Flex PCB application
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Micro pitch connector Flex PCB application

  • Micro pitch connector Flex PCB application
    Molex micro products can be used in applications ranging from mobile devices to a wide variety of hand held units and beyond. As applications are being developed for smaller, higher performing technologies, Molex micro wire-to-board, wire-to-wire, board-to-board, FFC/FPC and memory card connectors are being designed to meet these requirements, often times meaning higher performance in a smaller space. With products ranging from 0.35mm spacing, to as low as 42 AWG, minimal circuit sizes, multi amps per circuit and speeds up to 20 Gbps, Molex has a wide array of products to meet design parameters. In addition, Molex is driving micro products into new markets, such as automotive and medical, which have many of these attributes and characteristics. Molex is on the frontline, driving microminiature innovations for customers and engineers who need space savings, high-density signals and durability in connector designs.

    Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.

    Rugged Edge Rate® contact systems optimized for signal integrity performance.

    Edge Rate® contacts optimized for signal integrity performance
    Robust when "zippered" during unmating
    0.80 mm or 0.50 mm pitch systems
    Stack heights from 7 mm to 16 mm
    0.50 mm pitch system for up to 40% PCB space savings

    Thanks to their double know-how in both crimp connectors and CMM 2mm microconnector developments, Nicomatic has produced an innovative new connector/flex harness solution aimed at card-to-flex connections.

    Micro Circuits, a new technology offered by San Francisco Circuits, have some of the most advanced capabilities in arguably the fastest growing and most-requested PCB technology market, HDI printed circuit boards. HDI PCBs are circuits that offer much higher wiring densities per area than standard circuit boards, with finer lines and spaces, smaller vias and higher connection pad density.

    The micro circuits fabrication opportunities offered by SFC’s portfolio of capabilities easily overcome the limitations found in standard circuit technologies through the utilization of ultra-thin cores, fine line processing and alternative via methods to reduce the size and weight of your components while simultaneously enhancing performance.

    Aries Electronics interconnect products
    Aries Electronics is a leading manufacturer of a broad range of interconnect products and Correct-A-Chip� technology.

    Learn More

    High Density Connectors
    50mil(1.27mm) PITCH 2 PIECE CONNECTOR

    Learn More

    Multipin battery connector
    5mm and 3mm pitch battery connector for battery pack contact

    Learn More

    The HDI PCBs we offer include the following highly requested characteristics:

    Blind and/or buried vias
    Through vias from surface to surface
    20 µm circuit geometries
    30 µm dielectric layers
    50 µm laser vias
    125 µm bump pitch processing
    Our high density circuit boards have the technology-pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.

    Temp-Flex manufactures specialty wire and cable, and invests heavily in research and development to provide technological solutions to a wide variety of specialty markets. To ensure product quality and consistency, Temp-Flex is a fully equipped on-site manufacturing facility. An extrusion process is employed using fluoropolymer insulation with a concentration on thin walls for the medical industry and faster speeds in the electronics industry. Typically designed for extreme conditions and harsh environments, all Temp-Flex product lines adhere to RoHS compliancy standards.

    Show All
    Micro Miniature Wire and Cable
    Coaxial Cable
    Multicore Cables
    Flat Ribbon Cable
    Micro Miniature Wire and Cable

    Temp-Flex MediSpec High-Density Micro-Ribbon Cables
    High density
    Tight pitch tolerance ± 0.0127mm (0.0005”)
    Lower dielectric constant than flex circuits

    To increase circuit density from 0.3- to 0.5-mm pitch, connector designers shifted from one row of inline contacts to dual-row staggered contacts. By staggering the contacts, the spacing between adjacent contacts grows to 0.6 mm, making manufacturing the connector and its related flex circuit more feasible in high-volume production.

    Moreover, this change lets connector designers bring the connector's tails out in two rows. Naturally, this simplifies the job of laying out the pc board onto which the connector will be mounted. Even so, the tails' tight spacing requires these parts to be surface-mount devices to prevent solder bridges. The spacing also demands care in the board layout.

    At the connector's mating end, even greater care is necessary when laying out the flex circuit's contact pads and traces. To ensure a compatible FPC, connector vendors furnish their customers with clear guidelines for FPC layout. (Fig. 2).

    To mate with the FPC, the 0.3-mm connector relies on a combination of zero-insertion force (ZIF) and low-insertion force (LIF) contact engagement, which requires the use of a plastic actuator or flip-top on the connector.1 Older versions of the 0.3-mm connector employed a sliding top actuator that's more commonly used in FPC connectors with larger pitches.

    GMR7580C Vertical Mount Micro-D Connectors Compact Flange

    Save Space On Your Circuit Board – These Micro-D connectors feature .075 X .075 inch terminal spacing. Glenair's GMR7580 offers significant size and weight savings compared to traditional .100" pitch connectors.

    High Performance – Approved for British Standard BS9000, GMR7580 connectors meet the performance requirements of MIL-DTL-83513. Gold-plated TwistPin contacts assure best performance.

    guidance systems, on-board equipment, space and UAV systems. They are built to meet or exceed the specifications of MIL-DTL-83513.

    Latching and Rugged USB Micro-D solutions are also available below.

    Discrete Wired (WD)

    Soldercup (SS)

    Power Micro-D

    The layout of the proposed ECoG electrode array is shown in Figure 1A: its electrodes are enclosed by a circular area, connected by a straight cable to a rectangular assembly region. The electrode and cable regions were designed to be embedded in polyimide (PI), while the assembly portion was to be made out of silicon (Si). The ECoG signal-acquisition area (Figure 1B) contains 124 circular electrodes of three different sizes and a much larger reference electrode, situated beside the array. Conduction lines (15 μm wide) connect the electrodes to the assembly region where the output connectors are to be placed. Most connection lines are forced to pass through the centre of the array at a 15 μm inter-line distance in order to allow several radial cuts. These radial cuts perforate the flexible material of the array so that upon implantation it can conform to the curved shape of the brain surface without formation of folds. Beside the radial cuts there are curvilinear cuts which define the edges of the array, the outlines of its reference electrode and the borders of several flexible straps, which will mechanically fix the array to its carrier wafer in the final fabrication step. A detailed view of the ECoG electrode arrangement is shown in Figure 1D. Circular electrodes (109 in total) are designed in three different sizes (100, 300 and 500 μm in diameter), allowing to investigate how electrode size affects signal characteristics and, at a later stage, the features of stimulus-induced and stimulus-evoked field potentials. They are situated on a set of concentric hexagons and span the ECoG signal-acquisition area. Additionally, two sets of electrodes (100 μm in diameter) are arranged in groups outside the outermost hexagon, intended for high-resolution spatial frequency test measurements. The reference electrode, shown separately in Figure 1C, has a surface area of 2.5 mm2, and it is orders of magnitude larger than any other single ECoG electrode to ensure high signal-to-noise ratio. After completion of all manufacturing steps all flexible straps are cut through to release the ECoG device from its carrier wafer; the reference electrode is bent to the backside of the array, thus facing the skull during in vivo recordings (see Figure 1E). Holes of different sizes were designed in the reference electrode (1) to prevent crack formation in the metal film and (2) to minimize parasitic capacitive coupling since the hole-pattern of the reference electrode is a mirror image of the underlying electrode pattern. A detailed view of the connector-assembly region is presented in Figure 2, left image. Its 200 mm2 surface area is intended for the assembly of four 32-pin SMD-connectors. Each soldering pad has 210 μm × 560 μm area. The distance between two adjacent pads is 420 μm. The area of the connector- assembly region is 24 mm × 7.5 mm; the thickness of the silicon interposer is 400 μm.

    Horizontal Surface Mount (H0)

    B P M M1 S

    Thru-Hole Jackpost Jackscrew Jackscrew Jackscrew
    Order Hardware Separately Removeable Includes Nut and Washer Hex Head Removable E-ring Hex Head Removable E-ring Extended Slot Head Removable E-ring
    S1 L K F R

    Jackscrew Jackscrew Jackscrew Float Mount Float Mount
    Slot Head Removable E-ring Extended Hex Head Non-Removable Slot Head Non-Removable Extended For Front Panel Mounting For Rear Panel Mounting

    Though there are similarities among the various connector vendors' offerings, designers looking for fine-pitch FPC connectors will notice a general lack of standardization. The number of circuits or positions available is one example. Molex indicates a maximum of about 51 circuits; FCI, 57; and Hirose, 61. Conversely, current ratings tend to hover around 0.2 A per contact for the various product lines.

    Along with its inherently adaptable design, the MPI technology provides high I/O density and support for straight routing channels on the pc board. When laying out the board with which the MPI connector will mate, designers may place vias in the middle of the pads, simplifying routing. As a result, MPI lends itself to the development of large (over 2000-pin) interconnect arrays.

    The technology is currently available with 1-mm pitch and stacking heights as low as 0.028 in. (0.7 mm). The company has experimented with 0.8-mm pitch for board-to-board connectors, but it hasn't had much demand for this variation. Nevertheless, MPI has found its way into designs where other, finer-pitch connector technologies were tried but ultimately abandoned due to board-routing problems.

    Package heights are another example of variation. So while 2 mm is a common z-axis dimension, some vendors are introducing even shorter versions by continuing to extend the limits of their molding and stamping techniques. In the process, connector makers find ways to shave height off the connector's supporting plastic. They also thin their parts by experimenting with beam deflection (the degree of movement by the contacts) and the actuator (the element responsible for contact engagement and FPC retention force). A recent example from Molex is the company's 54809, a 0.3-mm pitch FPC connector with flip-top actuator that stands 1.3 mm off of the pc board.

    The same trend is evident among the 0.5-mm FPC connectors. This arena includes devices like Molex's 1.2-mm high right-angle connectors (54548/54550).

    Advances In Board Stacking: FPC connectors aren't the only components going below 0.5-mm pitches. Board-to-board connectors have been moving to 0.4 mm. Although the 0.1-mm difference in pitch sounds minor, it can save 30% in pc-board real estate.

    Temp-Flex MediSpec Micro Extrusion Primary Wires
    Pin-hole free insulation
    Biocompatible materials
    Tight tolerance down to 5% wire OD

    Genalog Is a Distributor for Samtec, together we offer a wide range of high quality, high speed, ruggedized interconnect products.

    Samtec are an ISO 9001:2008 certified manufacturer of connectors, board products and IDC cable assemblies, ranked no.1 by Bishop & Associates 10 years running (in USA). Samtec offer the facility to manufacture Application Specific Products designed to meet your specifications and can also provide samples within approximately three working days.

    Samtec’s vast product range covers the needs of all most any interconnection application with the New Flex circuits, EMI cages, High Speed and High Density products complimenting the range of standard headers, sockets and cable assemblies.

    Samtec ranges include:


    0.635mm pitch
    0.80mm pitch
    Differential Pairs
    Vertical & Edgemount designs
    Mixed technology footprints available
    Coaxial Cable assemblies

    Temp-Flex MediSpec Micro Coaxial Cables
    Robust and flexible dielectric
    Alternative to PTFE and ePTFE tape wrapped constructions
    OD down to 0.24mm (0.0093”)

    This new "two in one technology" ensures a high mechanical link and electrical continuity between 2mm pitch CMM micro-connectors and flat conductor Crimpflex technology (£A per crimp contact) and to MIL type relability standards.

    One of the major advantages is a small 2mm pitch that allows the reduction of space, but there is also a lower weight feature that enables replacement of the discrete wires and bulky cables still very present in avionics equipment. Nicomatic is able to reduce up to 30% weight with a solution that is thinner, lighter and more cost effective than a traditional cable.

    The increased use of printed ink and flex pcb orbits in Mil/Aero operations, Nicomatic introduces Micro-Flex since the use of printed ink and flex pcb orbits in Mil/Aero operations have increased over the years. Nicomatic's advanced connector method and flex harness meant for card-to-flex attachments are a result of dual expertise in crinkle connectors and CMM connectors.

    This modern dual purpose technology guarantees a greater mechanical connection along with electrical consistency across 2mm tone micro-connectors and horizontal conductor Crimpflex technology. Additionally , the 2mm pitch saves a lot of space and consists of a low-weight function allowing the exchange of separate wires and mass cords existing in avionics tools.

    Moreover, Nicomatic can lower the weight by 30% using a thinner and low-weight solution as compared to a conventional cord. These can be accessed in dual row up to 60 contacts along with fastening or stainless fixing hardware.

    .050" (1.27mm) x .050" (1.27mm) pitch board-to-board systems in a variety of board stacking heights, orientations and contact styles.

    Crimpflex™ housings
    Our CrimpFlex™ housings are made of thermoplastic filled with fibreglass classified UL94V-0. They are separated into two product ranges in 1.27mm & 2.54mm pitch and are dedicated to a use with Nicomatic contacts.
    They are also compatible with our headers and most of existing market standards (0.635mm).

    General features:

    UL E 125469
    Application scope: PCB connection, on discrete wire or flat cable, and extension cable
    Single and double row (2-50 in 2.54mm and 4-100 in 1.27mm)
    Locking (OJ, OL, OM, 1L, MOJ, MOJR, M4J) or detent style (OD)
    No polarization or locking (OF, 4F, 7F10, MOF, M4F)
    High density package in 90° (7F10)
    Connection to male walled headers (2E, 4E)
    Extension housings (OP, 1P)

    Series up to 10,000 cycles
    Wide array of board stacking heights
    Various mating orientations
    Rugged options
    Numerous contact styles
    Stack heights .235" (5.91 mm) - .754" (19.15 mm)
    Available up to 100 pins

    Micro pitch interconnects with high-reliability Tiger Eye™ and rugged Edge Rate® contact systems for high mating cycles, high-shock and vibration applications; integral ground/power plane interconnects with increased contact wipe and insertion depth for rugged applications; self-mating interconnects with mating/unmating forces 4-6x greater than typical micro pitch connectors.

    To assist you with your product search, simply click on a product tab below for a Narrow Results selector.

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    Micro W-to-W / W-to-B
    Micro B-to-B
    Micro FFC/FPC
    Micro Memory
    Micro I/O
    Spring Clips
    Micro W-to-W / W-to-B

    Micro IDT Coaxial Connectors
    Pitch: 0.40mm
    Circuits: 30 - 50
    Current: 0.2A
    Wire AWG: 42

    Pico-Clasp™ Wire-to-Board Connectors
    Pitch: 1.00mm
    Circuits: 2 - 50
    Current: 1.0A
    Wire AWG: 28 - 32

    IllumiMate™ Connector System
    Pitch: 1.00, 1.25mm
    Circuits: 4 - 25
    Current: 1.0 - 1.5A
    Wire AWG: 26 - 32

For furhter information, please feel free to contact us, www.pcbsino.com