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fingerprint identification Flex PCB application

fingerprint identification Flex PCB application
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fingerprint identification Flex PCB application

  • fingerprint identification Flex PCB application
    Since its establishment in 1995, Jin Sung Electronics(JSE) has been focusing on manufacturing Printed Circuit Boards(especially R-F PCB and FPC) and providing the finest quality products to the global market. JSE has constantly been dedicated to develop technologies in order to meet various needs from customers.
    JSE is the first company in Korea that developed Rigid-Flex Printed Circuit Board (R-F PCB) for a camera module which requires high-technology. Additionally, JSE developed a new technology, which is a “Waterproof ear-jack”; we are now a sole supplier for Samsung smart phone series with this technology. Moreover, we are manufacturing various types of PCBs, which are used for Mobile Phone, Camera, Medical, Automotive and many more industries.

    Since its establishment in 1995, Jin Sung Electronics(JSE) has focused on manufacturing Printed Circuit Boards(especially R-F PCB and FPC) and providing the finest quality products to the global market. JSE has constantly dedicated to develop technologies in order to meet diverse needs from customers.

    JSE is the first company in Korea that developed Rigid-Flex Printed Circuit Board (R-F PCB) for a camera module which requires high-technology. Additionally, JSE developed a new technology, which is a “Waterproof ear-jack”; we are now a sole supplier for Samsung smart phone series with this technology. More over, we are manufacturing various types of PCBs, which are used for Electronic monitoring system, Medical devices, Automotive, Communication, Industrial applications and Military/Aerospace , Navigation, Fingerprint identification industries. Now, JSE has become a global leading company in R-F PCB area.

    Get some thin sheets of polyimide which have copper on one or both sides. Polyimide is a yellow polymer with a high melting temperature and is sometimes called Kapton. A common type of copper-coated polyimide is DuPont "Pyralux" material.
    Pyralux sheets come in many different varieties of polyimide thickness, copper thickness and adhesive thickness (the "adhesive" is between the copper and polyimide holding everything together.) Copper thickness is given in oz per square foot, while adhesive and Kapton thickness is given in mil (1 mil =0.001 inch).

    Pyralux LF7062 (pictured) has 1/2 oz Cu, 1/2 mil adhesive and 1 mil Kapton. This works OK but is a bit thin and crinkly for the printer to handle.
    LF9120 has 1 oz Cu, 1 mil adhesive and 2 mil Kapton - seems to work best in the printer
    LF9210 has 2 oz Cu, 1 mil adhesive and 1 mil Kapton - stiffer, but works OK

    Other options are double sided copper ( a sandwich of Cu/Kapton/Cu held together with adhesive) and a roughened surface, denoted by R at the end of the part number.

    Sony Samsung and Omnivision are locked in a technology battle for superiority in CMOS image sensors. While Sony has the lead in stacking technology, i.e. stacking the sensor on top of the image processor and connecting them with TSVs, OmniVision and Samsung quickly adopted the same technology and gained design wins using stacked chip products.

    Rumor is that Sony will be working with GlobalFoundries on chip stack CIS, instead of Samsung to avoid any conflict with Samsung who is also in the CIS business.

    We recently updated the latest from Sony [see IFTLE 272] Now lets look at some of the latest activity from Omnivision and Samsung.

    Omnivision CIS

    technology, has over the last year equipped a large number of smartphones worldwide. One of its biggest clients, Huawei, traditionally integrates the latest technology in its flagship model every year. With the integration of the FPC1268 in the Huawei Mate 9 Pro and the Huawei P10 series, FPC has introduced a new kind of capacitive fingerprint integration: one that can be successfully integrated under glass. This technology, developed in collaboration with TPK, aims to be the new low-cost solution for fingerprint scanner integration.

    Following the Mate 9 Pro, the Huawei P10 is the latest smartphone to feature the capacitive fingerprint completely hidden behind the cover glass. The sensor is located under the home button in the device's front, under a unique TPK-developed glass cover that allows for new, highly attractive designs like the ultrasonic fingerprint.

    Using the same process as FPC's previous flagship product, the 1025, the integration no longer requires wire bonding but instead a specific TSV designed by an identified OSAT and based on Tessera's WLCSP solution. While previously used for CIS integration, this is the first time it has been used for fingerprint. Along with the ASIC, the fingerprint is integrated into an LGA package which is soldered on a flex PCB and covered by TPK's specially-designed glass.

    Fingerprint scanners are awesome. Why use a key when you have one right at the tip of your finger? Unfortunately, they’re usually unreliable or difficult to implement. Well not anymore! We’ve found this great fingerprint module from ADH-Tech that communicates over TTL Serial so you can easily embed it into your next project.

    The module itself does all of the heavy lifting behind reading and identifying the fingerprints with an on-board optical sensor and 32-bit CPU. All you need to do is send it simple commands. To get started, just register each fingerprint that you want to store by sending the corresponding command and pressing your finger against the reader three times. The fingerprint scanner can store different fingerprints and the database of prints can even be downloaded from the unit and distributed to other modules. As well as the fingerprint “template,” the analyzed version of the print, you can also retrieve the image of a fingerprint and even pull raw images from the optical sensor!

    Flexible fingerprint sensors

    Flexible fingerprint sensors enable fingerprint and vein imaging in new form factors not achievable with silicon chips.
    The growing need for improved security and user-friendly authentication methods is driving an increased adoption of fingerprint readers across banking, consumer electronics, healthcare and border control. Research reveals that fingerprint readers are going to be the dominant biometric technology due to their high accuracy and ease of use.

    Building on its industrially proven and low-cost organic thin-film transistor (OTFT) technology, FlexEnable has developed a flexible fingerprint sensor that brings a step change to where and how biometrics can be used in our lives.

    HERACLES4000/2000: High-speed PCB/FPC Green Laser Cutting Machine

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    Case: there was a listed company, adopted HERACLES4000 for production updating, the manufacturing procedure was reduced from 9 steps to 4 steps, saved 55% procedure time and 4 workers; no need of miller, puncher or knife mold; the laser cutting speed was 10% faster than milling cutting speed; the yield rate achieved 99.9%.

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    China/Taiwan Update

    March monthly sales were just released for Taiwan-listed companies, many of which manufacture in China:

    March 2016 electronic equipment shipments rebounded from their February seasonal low point but were 2.4% down compared to March 2015 (Chart 1).
    ODM March revenues performed similarly (Chart 2).
    Semiconductor shipments to SE Asia remained in balance with electronic equipment shipments on a 3/12 growth basis (Chart 3).
    Wafer foundry sales rebounded but were slightly below the March 2015 level (Chart 4).
    Package and test sales in March 2016 were identical to March 2015 (Chart 5).
    March 2016 memory sales were 14% March 2015 (Chart 6)
    Passive component shipments in March were up 2.4% compared to March 2015 (Chart 7).
    Sales by solar/photovoltaic suppliers were near their December 2015 all-time high (Chart 8).
    Rigid and flex PCB shipments were down 1.8% in March 2016 versus March 2015 (Chart 9).
    Rigid CCL laminate shipments mirror Rigid PCB sales (Chart 10).
    Custer Consulting Group’s Asia/Pacific PCB leading indicator points to printed circuit board declines versus the same months in 2015 at least until early summer (Chart 11).
    Source: Company financials with Custer Consulting Group analysis.

    Europe Update

    Eurostat just released its February electronic supply chain results:

    Industrial production declined for the EU27 as a whole as well as Germany, France, Italy and the UK (Chart 12).
    Electronic equipment production declined versus January (Chart 13) as its 3/12 growth rate dropped to +3.3% (Chart 14).
    Semiconductor shipments to Europe are equivalent to electronic equipment production on a 3/12 growth basis when semiconductors are denominated in euros (Chart 15).
    Motor vehicle production remained strong but slipped from its January record high (Chart 16).
    Aircraft production also was strong but below its January 2016 record (Chart 17).
    Instrument equipment production remained robust (Chart 18) but the very volatile medical electronics sector saw production decline 5% from January (Chart 19).
    Electronic assembly activity rebounded from its recent declines (Chart 20).
    Electronic wiring device production eased slightly (Chart 21) however our leading indicator points to slower PCB growth ahead (Chart 22).
    Chart 23 summarizes the annualized (12/12) and 3-month (3/12) growth of the European electronic supply chain.

    Source: Company financials with Custer Consulting Group analysis.

    Worldwide Semiconductor Revenue Expected to Decline 0.6% in 2016 (Chart 24)

    Worldwide semiconductor revenue is forecast to total $333 billion in 2016, a decrease of 0.6% from 2015, according to Gartner, Inc. This is following a decline of 2.3% in 2015 due to weakened demand for key electronic equipment, elevated inventory levels and the continuing impact of the strong dollar in some regions.

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    We--Shenzhen Greattong Electronics Co., Ltd.are a China big manufacturer Group for PCB design, clone, manufacture and circuit boards assembly OEM EMS field . Our Services include: 1) Surface mount/completing and assembling of various.....
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    An advanced method for the quality assessment of microelectronic assemblies has been developed by combining IR thermography and several techniques for stimulation by transient temperature fields. The method exploits singularities in materials and interconnections by the observation of perturbations in transient heat flow phenomena. For very light microelectronic systems like chip-on-flex assemblies a method was developed taking advantage of short stimulations by photoflash. Such a method provided possibilities for detecting defects on the level of a single interconnection with a pitch of 80 μm. In addition, a programmable array of thermo-electric converters, prepared for the testing of a large variety of microelectronic assemblies, was also used to perform transient IR imaging for chip-on-flex assemblies.
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    Abstract: Fingerprint Sensor Datasheet Version 2.2 Sept. 2007 Timing diagram for flash interface: Register , Features Here is a high-level feature list for the SW6888 fingerprint sensor: Programmable scan rate , Fingerprint Sensor Datasheet Version 2.2 Sept. 2007 Block Diagram SW6888 is comprised of analog and , GPIO parallel interface mode, the fingerprint sensor operates in the fastest, most efficient mode. For , Version 2.2 Sept. 2007 SW6888 Single Chip Fingerprint Sensor Datasheet General Description
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    "For only the second time in its history, the worldwide semiconductor market is expected to have two consecutive years of revenue decline," said James Hines, research director at Gartner. "We expect a decline of 0.6% in 2016 as the industry waits for the next demand driver to emerge."

    Lowered estimates for production of PCs, ultramobiles and smartphones is reducing the demand for semiconductors in 2016, and no significant near-term driver has appeared to offset the reduction in demand in these key semiconductor markets. While there are emerging opportunities for semiconductors in the Internet of Things (IoT) and wearable electronics, these markets are still in the early stages of development and are too small to have a significant impact on overall semiconductor revenue growth in 2016.

    Powerful Cutting Capability
    HERACLES4000/2000 is capable to cut all kinds of HDI board, PCBA, FPC, Rigid-Flex PCB within 3mm thickness, like semiconductor packaging board, camera module board for mobile phone, fingerprint identification module board and etc.. It could be set up within 24 hours, extremely convenient for urgent production.

    High Production Capacity
    According to our tests, HERACLES4000/2000 works stably with high efficiency, average UPH could be achieved to 20K, this production capacity equals to 3pcs of 10W UV laser cutting machine, 40pcs of millers or 60pcs of punchers.

    The Finger Print Sensor is one optical fingerprint sensor which will make fingerprint detection and verification adding super simple.There’s a high powered DSP chip AS601 that does the image rendering, calculation, feature-finding and searching. You can also enroll new fingers directly - up to 162 finger prints can be stored in the onboard FLASH memory. There’s a red LED in the lens which will light up during taking photos so that you know its working condition. It is easy to use and by far the best fingerprint sensor you can get.

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    FlexEnable’s OTFTs have been combined with partner ISORG’s organic photodiodes (OPDs) to create small and large area flexible optical sensors that can be used to image both fingerprints and veins. Our optical sensor is the only flexible sensor technology that has achieved 500 dots per inch (dpi) image resolution making it suitable for applications requiring standard-compliant fingerprint enrolment and identification. It can be paired with any end-user software to create low false acceptance (FAR) and rejection rates (FRR).

    With a thickness less than 0.3 mm, the optical fingerprint sensors come in two sizes: 1” x 2” and 3” x 3.2” and. The 1” x 2”sensors can be used for integration in smartcards or mobile phones. The 3” x 3.2” sensors are suitable for optical fingerprint and vein scanners for border control or applications that require multi-finger verification. The sensors are suitable for FBI certification.

    This is the more economical version of the GT-511 which has a decreased memory capacity (compared to the GT-511C3). The module can only store up to 20 different fingerprints but is capable of 360° fingerprint recognition and download and upload templates using serial interface. If you are on a budget and need only a small number of fingerprints stored, this is the perfect option for you!

    Thanks to conductive layers, TPK's solution allows for the precise detection and identification of the fingerprint under glass. Everything is packaged in a metal ring that forms part of the home button.

    This report provides a complete analysis of chip fabrication and package processes, along with a cost estimate. Also included is a comparison with FPC's previous capacitive fingerprint generation, the FPC1025, and Qualcomm's new ultrasonic fingerprint, the Sense ID.

    We last looked in depth at Omnivision in IFTLE 199 [ see IFTLE 199 Omnivision Roadmaps 3D stacking for CMOS Image Sensors…”]

    Make your next project super-flexy with a prototyping board that can twist and bend. We took our lovely classic perma-proto design and had it made from incredibly thin polyamide film. It's extremely bendable, and you can cut it easily with scissors. It has a bend radius of 1cm or better (you can also crease it but that might break a trace if you crease a trace) and you can solder any components to the pads. Sensors? Wearables? Tubular-tronics? We have no idea what people are going to use it for but we know it is going to be awesome.

    The flex PCB is really floppy, so you may need to support it if you solder electronic components on, it won't stay 'straight' on its own unless given some sort of physical support.

    Comes as a single flex PCB per order.

    The Omnivision OV13860 introduced in late 2014 is a 13 MP back side illuminated sensor with 1.3um pixels (actually larger than other 13MP sensors). It is the first Omnivision’s CIS built with stacked die technology which separates the imaging array from the image sensor processing circuits in the stacked structure. This allows for more functionality to be incorporated on the sensor die while resulting in a smaller size due to the stacking. [link].

    Omnivision then announced the OV16850, a 16MP imager for smartphones. Using an 1.12um pixel and leveraging OmniVision’s stacked die technology, which captures stills and video in native 16:9 aspect ratio. This was followed by the OV23850 a 23.8 MP high resolution CIS. (images below [link]

    The roughened sheets and double sided sheet work OK. However, Pyralux with 2 oz or thicker copper can be difficult to feed to the printer, especially if there is copper on both sides.

    See if you can get a free sample from DuPont. Occasionally, Pyralux sheets turn up on eBay.

    Cut the Pyralux sheets to 8.5x11 or 8.5x14 inches with scissors or a knife. Avoid smudging the copper with fingerprints or oil, which can block the etch solution later. To protect the printer, try to keep the edges relatively flat and free of burrs.

    In order to meet various needs from customers, JSE holds corresponding certificates to meet the World Class Quality. Currently, we have 2 patents, which enhance our production capability, and ISO-9001, ISO-14001, ISO/TS-16949 and UL. Additionally we are complying with IPC-6012, IPC-6013 and IPC-A600H; moreover, we will obtain AS-9100 within this year.

    Your favourable reply would be highly welcomed. If you have any question, please feel free to contact me anytime.

    In order to meet various needs from customers, JSE holds corresponding certificates to meet the World Class Quality. Currently, we have 2 patents, which enhance our production capability, and ISO-9001, ISO-14001, ISO/TS-16949 and UL and will obtain AS-9100 within this 2017. We are complying with IPC-6012, IPC-6013 and IPC-A600H.
    The last, in 2016, we became an authorized OFFSET trading company. If you are interested in the offset trading, please visit the Korean governmental web (offset.gobizkorea.com)

For furhter information, please feel free to contact us, www.pcbsino.com