High power transistor Aluminum mcpcb aplication

High power transistor Aluminum mcpcb aplication
Single Layer Metal Core PCB

A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.

Double Layers Metal Core PCB

Double layers MCPCB is consisting of two layers of copper conductor, put them on same side of metal core (usually aluminum, copper or iron alloy). The metal base is on the bottom of whole MCPCB, which is different from double sided MCPCB(the two copper layers were put on the each side of metal core respectively), and you can only populate SMD on top side.
Different with Single layer MCPCB, 2 layers MCPCB requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together.
Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.
The processing steps of the MCPCB with the metal base embedded in the PCB are comparatively complex as hole plugging is required after primary drilling on the metal base in order to isolate it from the circuitry.

Double Sided Metal Core PCB

It also has same two layers of copper conductor like Double layers MCPCB, but the metal core is in the middle of two conductor, so there're conductors (trace) on both sides of metal core, and were connected to each other by Vias. So we named it "Double sided MCPCB", and you can populated SMD on both top and bottom.
Different with Single layer MCPCB, double sided MCPCB also requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together. But sometimes, some raw Metal Clad material vendor will supply board material which already laminated.
Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.

Multi Layers Metal Core PCB

Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it "
Multi Layers MCPCB
". The structure is similar with FR4 Multi Layers, but it much more complex to make.
You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.
Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCBor double sided MCPCB.

Other Specifications: 1OZ 2OZ 3OZ High Power Transistor Aluminum PCB Board , Metal Core Multilayers PCB Quick details: # layers:1-4layers # Base material: Aluminum/Copper/Iron Alloy # Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K. # Withstand voltage:2000-8000V # Board Thickness: 0.5mm~3.0mm(0.02"~0.12") # Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 6 OZ # Outline: Routing, punching, V-Cut # Soldermask: White/Black/Blue/Green/Red ,Taiyo PSR4000 white # Legend/Silkscreen Color: Black/White # Surface finishing: Immersion Gold, HASL, OSP # Max Panel size: 600*1200mm(23.62"*47.24") # Packing: Vacuum/Plastic bag # Samples L/T: 4~6 Days Single Layer Metal Core PCB A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask. The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air. The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates. Double Layers Metal Core PCB Double layers MCPCB is consisting of two layers of copper conductor, put them on same side of metal core (usually aluminum, copper or iron alloy). The metal base is on the bottom of whole MCPCB, which is different from double sided MCPCB(the two copper layers were put on the each side of metal core respectively), and

Our Nanotherm-LC material has a very short thermal path from the source – a semiconductor devices soldered to the copper surface – to the heatsink. This makes it the premier solution for cooling high power electronic circuits, such as high brightness LED lighting and LED packaging, or power devices such as MOSFET or IGBTs.

In general, thermal equations for semiconductor devices can be modeled after electrical equations, such that the well known and beloved Ohm's Law (V = I × R) becomes ΔT = P × θ, where ΔT is the thermal differential in °C, P is the power in watts, and θ is the thermal impedance (°C/W). For semiconductor devices, ΔT is the temperature differential from the junction of the device (e.g., the hottest point in the die) and another point (e.g., the case, ambient air, or board), and the thermal impedance, θ, is the thermal resistance from one point to another. Thermal impedance is often measured from the junction of an IC to another point (the ambient air, package, case, or board) and is described as junction-to-ambient resistance, θJA, junction-to-case resistance, θJC, or junction-to-board resistance, θJB, in data sheets (Figure 1).

Figure 1. Semiconductor IC thermal impedances can be modeled in much the same way as electrical circuits, as described by Ohm's Law.
Good thermal design is required to keep a device operating within safe temperature limits. The junction temperature, TJ, for an IC can be calculated as TJ = TA + (P × θJA) and it should never exceed the limit listed in the manufacturer's data sheet (generally ranging from +125°C to +175°C). Thermal impedance values also should be obtained from the original manufacturer, as they are both highly package and device dependent.
It is important to note that, while thermal equations can be modeled as electrical equations, the expected accuracy when working with electricity does not hold true for thermal operation. Often, actual thermal characteristics can vary as much as 30% from the calculated value.
Power Considerations for the Board
Board layout should be considered from the very beginning of a design. The most important rule for high power circuit boards is to know your power path. The location and amount of power flowing through a circuit is a major factor when deciding the IC position and type and amount of heat dissipation required on the printed circuit board (PCB).
Many factors affect the amount of layout for a given design. These factors include:
The amount of power flowing through the circuit
The ambient temperature around the device and the board
The amount of airflow around the device and the board
The board material
IC density on the board
Component Placement
Analog circuits and mixed-signal circuit boards generally include high-power analog blocks and sensitive digital or low-power analog blocks. Begin the layout by designing and placing power blocks. Keep connections in individual power blocks short and wide and ensure against unnecessary ground loops and noise generation. Multiple tutorials and application notes have been written about layout techniques and recommendations for high power circuits.1,2,3 In general, remember to:
Identify and reduce current loops, especially high current paths.
Limit resistive voltage drops and other parasitics between components.
Locate high-power circuitry away from sensitive circuitry.
Use good grounding techniques.
Furthermore, avoid collecting multiple power components together on a PCB. Placing these heat-generating components evenly over the board maximizes the thermal balance of the board and protects the PCB from warping. Efficiently reducing heat on the board also protects other sensitive circuitry and signals during operation.
IC and Component Mounting
As power flows through a circuit, both passive and active components generate heat. Heat generated in passive components and ICs alike must be dissipated to the cooler ambient air around the device. This heat is generally dissipated through the package or through the lead frame of the device.
In the past few years, IC package manufacturers have built increasingly thermo-friendly packages. However, even with these packaging advances, heat dissipation becomes increasingly difficult as IC continue to shrink in size.
Many IC packages and board designs do not leave much room for an external heat sink, requiring another method to extract heat—enter the exposed pad (EP). A die inside a package with an EP is directly connected to the EP for optimum thermal performance. Correctly mounting these ICs on the PCB optimizes heat transfer from the package to the board. Discussions on thermal considerations and mounting techniques for individual ICs have been well documented by a number of reliable sources and are out of the scope of this paper. For more information on mounting techniques for individual packages, see application note 862, "Thermal Considerations of QFN and Other Exposed-Paddle Packages."
Heat Sinks
Components in the power path can generate large amounts of heat. These components need to dissipate the heat quickly and efficiently to the ambient environment. One commonly used method of heat dissipation is the addition of an external heat sink to the board. The purpose of a heat sink is to remove heat from a device and distribute it to the ambient air. Generally made from highly thermal conductive materials like aluminum or copper, external heat sinks provide a larger area to dissipate heat and should be placed in the path of airflow, if possible, for maximum dissipation. IC positioning becomes increasingly important when using external heat sinks and the board must be designed so that a heat sink can be affixed in the proper location. To optimize heat transfer from the IC to the heat sink, you can also use a thermal epoxy to ease the heat transfer between the devices.
Heat sinks generally require a great deal of room on a board and may not be appropriate for small or compact applications. When space is at a premium, design the PCB to optimize heat transfer through the board itself.

I. I NTRODUCTION T (LEDs) HE JUNCTION are significantly temperatures related to of the light-emitting optical performance diodes and reliability of LEDs. The optical output power of the LED is degraded, and the lifetime of the LED is also shortened with increasing junction temperature [1]. Heat dissipation is therefore a critical issue for the use of high-power LEDs and general lighting applications. Normally, high-power LEDs are mounted on metal-core printed circuit boards (MCPCBs). An MCPCB has a dielectric layer for insulation and a thick metal plate for heat dissipation. In a conventional MCPCB, a dielectric layer with a composite of epoxy polymer and inorganic powders has been used to increase the heat dissipation performance of the MCPCB. In many cases, alumina powders are used for the inorganic filler of the MCPCB dielectric layer. The thermal conductivities of the composite are in the range of 2–5 W / m · K, according to the amount of alumina powder in the dielectric layer. Dielectric layers of MCPCBs with higher thermal conductivities are necessary for high-power LED applications. The aerosol deposition (AD) process may be a good candidate for the ceramic dielectric layer of an MCPCB with good thermal properties. The AD process is based on room- temperature impact consolidation of submicrometer ceramic particles that are accelerated in a carrier gas to high velocities of 100–600 m/s [2]. During impact and interaction with the substrate, these particles are divided into small crystallites and form dense ceramic films on the substrate [3]. In this letter, MCPCBs with a ceramic dielectric layer deposited by the AD process have been employed for high- power LED heat dissipation. The electrical properties of the deposited dielectric film were measured. The thermal resistances of the developed MCPCBs were compared with conventional MCPCBs by thermal transient measurements. II. E XPERIMENTS The raw powders used for film deposition were commer- cial alumina powders (Showa Denko K.K, AL160-SG-3). The powders were dried and stored in 150 ◦ C drying oven before the deposition process to minimize the effect of moisture. The average particle size of the powders was 0.4 μ m. Films were deposited on an aluminum plate, which is used for conventional MCPCB and also deposited on copper plates and glass for evaluation. The major process parameters are shown in Table I. In the vibrating powder chamber, powders are mixed with gas and carried to the nozzle in the deposition chamber. Large agglomerates are filtered by a cyclone filter during transfer to the deposition chamber. Aerosol flows attain high speed from the pressure difference between two chambers and collide with the substrate, which is scanned for uniform growth of the film. Material properties such as crystal structure and microstructure were characterized by an X-ray diffractometer (M18XHF, MAC Science) and a field emission scanning electron micro- scope (JSM-7000F, JEOL Ltd.). The electrical properties of the deposited films were measured using a pA meter/dc voltage source (HP4140B, Agilent Technologies) and a withstanding voltage tester (TOS5101, Kikusui Electronics Corporation). Thermal resistance measurements of the dielectric layer of MCPCBs were carried out by a thermal transient tester (T3Ster, MicReD Ltd.) [4]. In this measurement, transient cooling curves are converted to structure functions for nonuniform 1-D RC networks. This function plots the cumulative thermal capacitance C Σ as a function of the cumulative resistance R Σ [5], [6]. III. R ESULTS AND D ISCUSSION Fig. 1 shows the microstructure of raw powders and as- deposited alumina films by AD. A dense thick film on the metal plate was formed directly from submicrometer powders. From X-ray diffraction, the film was revealed to exist as a single α − Al 2 O 3 phase without any secondary phases. Fig. 2 shows the electrical properties of the deposited alumina films. The film showed very low leakage behavior up to an applied bias of 100 V. The breakdown voltages continuously increased with aerosol-deposited film thickness, but dielectric strengths were saturated at thicknesses over 10 μ m. The electrical measurement results show that the insulation properties of aerosol-deposited alumina films are suitable for high-power LED applications. Fig. 3 shows test samples for thermal transient measurement. The LED chips used were InGaN-based 1-W blue LEDs. The thermal resistance results of the MCPCBs are shown in Fig. 4. The thermal resistance of an MCPCB with an alumina dielectric layer was compared with a conventional MCPCB. The thermal conductivity of the conventional MCPCB dielectric layer used in this comparison was 2 W / m · K from the specification sheet. Cumulative structure function curves can be divided into several regions, because structure function is based on the 1-D RC networks. The test structures of the two kinds of MCPCB were exactly the same, except in the dielectric layer region. Therefore, the regions of curves between the LED chip and the MCPCB were very similar but showed different behaviors from the MCPCB dielectric region. The thermal resistance of the alumina film dielectric layer was about 4–5 K/W lower than the thermal resistance of a conventional dielectric layer in all packaged and bare LED chip test conditions. These results show better performance of the AD film MCPCB compared to the conventional MCPCB, which means that the junction temperature can be lowered, giving the LEDs a longer lifetime. IV. C ONCLUSION A new inorganic dielectric-layer-coated MCPCB was suc- cessfully prepared by an AD method. The deposited dielectric film was a dense alumina film with high thermal conduc- tivity, rather than the conventional ceramic polymer composite film. Compared with conventional MCPCBs, MCPCBs with an aerosol-deposited alumina film dielectric layer showed low thermal resistance and good heat dissipation performance. This new MCPCB, with its high thermal conductive dielectric layer, should be a good candidate for thermal solutions for high-power LED applications.

Double layers MCPCB is consisting of two layers of copper conductor, put them on same side of metal core (usually aluminum, copper or iron alloy). The metal base is on the bottom of whole MCPCB, which is different from double sided MCPCB(the two copper layers were put on the each side of metal core respectively), and you can only populate SMD on top side.
Different with Single layer MCPCB, 2 layers MCPCB requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together.
Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.
The processing steps of the MCPCB with the metal base embedded in the PCB are comparatively complex as hole plugging is required after primary drilling on the metal base in order to isolate it from the circuitry.

Double Sided Metal Core PCB

It also has same two layers of copper conductor like Double layers MCPCB, but the metal core is in the middle of two conductor, so there're conductors (trace) on both sides of metal core, and were connected to each other by Vias. So we named it "Double sided MCPCB", and you can populated SMD on both top and bottom.
Different with Single layer MCPCB, double sided MCPCB also requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together. But sometimes, some raw Metal Clad material vendor will supply board material which already laminated.
Compared with normal FR4, this sturcture need more technology and experience on laminating of two layers together with metal core.

Multi Layers Metal Core PCB

Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it "
Multi Layers MCPCB
". The structure is similar with FR4 Multi Layers, but it much more complex to make.
You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.
Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCBor double sided MCPCB.

Application of MCPCB

LED lights:High-current LED, Spotlight, high-current PCB
Industrial power equipment:High-power transistors, transistor arrays, push-pull or totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-changing device (Inverter)
Cars:firing implement, power regulator, exchange converters, power controllers, variable optical system
Power:voltage regulator series, switching regulator, DC-DC converters
OA:Printer driver, large electronic display substrate, thermal print head
Audio:input - output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier
Others:Semiconductor thermal insulation board, IC arrays, resistor arrays, Ics carrier chip, heat sink, solar cell substrates, semiconductor refrigeration device

Long used in instruments and computers as visual indicators for signal integrity and operations status, LEDs are ideal choices due to their high reliability, low power use, and little-to-no-maintenance needs. Recent market interest in LEDs is as lighting devices. However, as illumination becomes the focus, power consumption has risen dramatically.

Device heat fluxes rival those of CPUs and other semiconductor packages. Thus, the thermal management of LEDs has taken center stage for their successful implementation.

It is important to remember that an LED is not a high-temperature, filament-type lighting device. While a single LED is a cold and efficient light source, high-power LED applications, including arrays, need thermal management similar to other semiconductor devices.

Most LEDs are designed in surface-mount (SMT) or chip-on-board packages. In the new 1 to 8-W range of SMT power LED packages, the heat flux at the thermal interface can range from 5 to 20 W/cm2.

These AlInGaP and InGaN semiconductors have physical properties and limits similar to other transistors or ASICs. While the heat of filament lights can be removed by infrared radiation, LEDs rely on conductive heat transfer for effective cooling.

As higher power is dissipated from LED leads and central thermal slugs, PCBs have changed to move this heat appropriately. Standard FR-4 PCBs can still be used for LEDs with up to 0.5 W of dissipation, but metallic substrates are required for higher levels.

A metal core PCB, also known as an insulated metal substrate (IMS) board, is often used underneath 1-W and larger devices. These boards typically have a 1.6-mm base layer of aluminum with a dielectric layer attached.

Copper traces and solder masks are added subsequently. The aluminum base allows the heat to move efficiently away from the LED to the system. But thermally dissipating PCBs are not always adequate or suitable for LED applications. Other cooling design choices are available, and it can be challenging to select the most appropriate and cost effective solution for a given application.

The cooling method

Cooling method and the optical lens are two parameters that play a pivotal role in the success of an LED. These factors affect the shape, size, and construction of the luminaire that comprises the lighting unit. Because long life and fail-safe operation are essential for any LED, the cooling process is uniquely critical.

An LED’s plastic body is not thermally conductive, and the device does not radiate heat. The only effective cooling method is to remove heat through the device bottom.

Advantage:

1. Aluminium PCB & LED PCB factory directly
2. Aluminium PCB & LED PCB Have the comprehensive quality control system
3. Aluminium PCB & LED PCB good price
4. Aluminium PCB & LED PCB quick turn Delivery time from 48hours.
5. Aluminium PCB& LED PCBcertification(ISO/UL E354810/RoHS).
6. 8 years experience in exporting service
7. Aluminium PCB& LED PCB is no MOQ.
8. PCB is high quality.Strict through theAOI(Automated Optical Inspection),QA/QC,fly porbe ,Etesting

material

our
Aluminium base material :bergquist(usa),Polytronics(Taiwan),totking(china),etc. thermal conductivity range from 1W/m.K to 8 W/m.K Withstand Voltage range is 2KV to 8KV which can help us to meet any need of our clients,also reduce purchasing cost.

Product Tags: aluminium based pcb aluminum printed circuit board

Nanotherm-LC is fabricated from a sheet of NCA – “Nano-Ceramic Aluminium”. This is a sheet of aluminium where the top surface has been converted to nano-ceramic – a material which is extremely thermally conductive, but which stops electricity in its tracks.

A layer of copper is then bonded to the NCA using an ultra-thin layer of adhesive (typically only 4µm), creating a circuit layer. The completed substrate can be processed using standard PCB processing techniques. It is essentially a higher performance replacement to traditional MCPCB or IMS materials, and as a result of the nano-ceramic process, can be extremely cost effective.

Products and Services:

0.5 OZ 2 Oz 3.0 OZ Round Metal Core PCB Board with Aluminum / Copper / Iron Alloy Base

1 - 4 Layer Round High Power LED Metal Core PCB Board with Lead Free HASL Finishing

Application of MCPCB

LED lights:High-current LED, Spotlight, high-current PCB
Industrial power equipment: High-power transistors, transistor arrays, push-pull or totem pole output circuit (to tem pole), solid-state relay, pulse motor driver, the engine Computing amplifiers (Operational amplifier for serro-motor), pole-changing device (Inverter)
Cars: firing implement, power regulator, exchange converters, power controllers, variable optical system
Power:voltage regulator series, switching regulator, DC-DC converters
OA: Printer driver, large electronic display substrate, thermal print head
Audio: input - output amplifier, balanced amplifier, pre-shield amplifier, audio amplifier, power amplifier
Others: Semiconductor thermal insulation board, IC arrays, resistor arrays, Ics carrier chip, heat sink, solar cell substrates, semiconductor refrigeration device

Express PCB		Rigid PCB Rapid Prototype,24 hours
Fr4 PCB		prototype Lower to 15USD !
Rapid Prototype		Fr4 Rigid PCB Rapid Prototype China,

MCPCB		MCPCB Manufacturer China, Shenzhen
Aluminum PCB:		Aluminum Metal Core PCB manufacturing, Fabrication
Aluminum PCB:		single side, double side MCPCB, 0.5-5mm or more

Rogers 4350B		Rogers 4350,Rogers 4003 Manufacturing
Rogers 4350B		Rogers 4350B,4003C PCB Manufacturer
Ro4350B		Rogers High Frequency PCB Manufaturing China

Turnkey Services		Turnkey PCB Assembly Services,
Turnkey services		Print circuit board Manufacturing, Turnkey Services
Turnkey Assembly		Through Hole PCB components wave soldering Assembly

High power transistor Aluminum mcpcb aplication

PCB Supplier Shenzhen, China, PCB Manufacturer, Turnkey services

Express PCB

Rigid PCB Rapid Prototype,24 hours

MCPCB

MCPCB Manufacturer China, Shenzhen

Rogers 4350B

Rogers 4350,Rogers 4003 Manufacturing

Turnkey Services

Turnkey PCB Assembly Services,

High power transistor Aluminum mcpcb aplication