Mining LED lamp Aluminum mcpcb aplication

Mining LED lamp Aluminum mcpcb aplication
Product's design: as per customer's drawing or sample.
Production equipment: machining center, CNC engraving milling machine, CNC, lathe machine, millingmachine, punching machine, CNC milling machines, centerless grinding, and many other precision equipment.
Provide one-stop service from PCB manufacturing to SMT PCB assembly, we have fourhigh speed automatic SMT lines for SMT assembly with Fuji machines, AOI, SPI, X-RAY, and BGA rework facilities. We also provide convenient quick-turn parts sourcing for our customers globally.
QC system: 100% inspection before shipment.
Our supplier certification system and standard IQC system in place ensures your boards' quality.
Packaging: vacuum bag, single polybag, bubble bags, wooden case or as requests.

(Hole Size)
(Drilling hole size)
0.6-6.0 mm
(FG hole size)
0.6-6.0 mm
(Hole tolerance)
± 0.075 mm
(Tolerance of hole position)
± 0.1 mm
(Aspect ratio)
5 : 1

(Solder)
(Min solder bridge)
4 mil

(Dimension)
(Tolerance of outline dimension)
± 0.1 mm
(Max board size)
(Length)：1500mm
(Width)：300mm

(Impedance)
(Impedance tolerance)
± 10%

(Heat conductivity)
(Low heat conductivity)
1.0-1.5W/m*k
(Mid heat conductivity)
1.5-1.8W/m*k
(High heat conductivity)
2.0-3.0W/m*k
(Peel strength)
≥1.8 N/mm
(Surface resistance)
≥1*105m
(Volume resistrivity)
≥1*106m
(Breakdown voltage)
≥2KV/mm
(The solder resistance)
260°C , 10min,
(260°C,10min, no delamination, no blister)
(Dielectric constant)
≤4.4
(Dielectric power factor)
≤0.03

Aluminum PCB for LED Bulb PCB board High Thermal conductivity MCPCB For LED Bulb Light:

Material:Alu,1.6mm

Soldermask Color:White

Legend Color:Black

Size:90*90mm/pcs

Surface Finish:HASL

Layer:1

Thermal Conductivity:1.0w/m.k

It's can be used for LED Bulb Light Fixture.

Displays & Lighting Materials

DuPont is a leading supplier of innovative materials and processes enabling more efficient and sustainable Light Emitting Diode (LED) lighting as well as advanced liquid crystal display (LCD) enhancements and organic light emitting diode (OLED) display technologies.

Heraeus Celcion® is a thick film materials system designed to build circuits on aluminum substrates.

Traditionally, MCPCBs are constructed using a subtractive process, adding then removing material. This takes time and often wastes costly material.

Our Aluminum core PCB manufacturing capabilities

Features Capability
Quality Grade Standard IPC 2
Number of Layers 1-4 layers
Order Quantity 1pc – 10000+pcs
Lead Time 3days – 5weeks
Material Aluminum core (Domestic 1060), Copper core, FR4 covering
Board Size Min 6*6mm | Max 610*610mm
Board Thickness 0.8mm – 5.0mm
Copper Weight (Finished) 0.5oz – 10.0oz
Solder Mask Color Green, White, Blue, Black, Red, Yellow
Silkscreen Color White, Black, Yellow
Surface Finish HASL – Hot Air Solder Leveling
Lead Free HASL – RoHS
ENIG – Electroless Nickle/Immersion Gold – RoHS
Min Drilling Hole Diameter 6mil

Advantage of MCPCB

1.heat dissipation

Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.

2. thermal expansion

Thermal expansion and contraction is the common nature of the substance, different CTE is different in thermal expansion. As its own characterics, aluminum and copper have unique advance than normal FR4, thermal conductivity can be 0.8~3.0 W/c.K.

3. dimensional stability

It is clear that the size of the metal-based printed circuit board more stable than insulating materials. The size change of 2.5 ~ 3.0% when metal core pcb and aluminum sandwich panels was heated from 30 ℃ to 140 ~ 150 ℃.

4. Less expensive.

Aluminum is indigenous to a variety of climates, so it’s easy to mine and refine. That makes it significantly less expensive to mine and refine than other metals. By extension, the manufacturing costs associated with products using aluminum are also less expensive. Aluminum PCBs are also a less expensive alternative to heat sinks.

5. Friendly to the environment.

Aluminum is a non-toxic, recyclable metal. From the manufacturer through to the end consumer, using aluminum in PBCs contributes to a healthy planet.

However, since the CSP package removes the ceramic substrate as a heat sink, heat is transferred directly from the LED substrate to the PCB to become a strong point source. At this point, the cooling challenge for the CSP from the "level (LED base level)" into a "two (the entire module level)."

In this case, the module designer began to use the metal-covered printed circuit board (MCPCB) to deal with the CSP package.

Figure 1, 1x1 mm CSP LED Thermal radiation model on 0.635 mm AlN ceramic substrate (170 W / mK).

Figure 2, 1x1 mm CSP LED on the MCPCB (150 W / mK) on the thermal radiation model.

As can be seen from Figure 1 2, the researchers conducted a series of thermal radiation simulations for MCPCB and aluminum nitride (AlN) ceramics. Due to the structure of the CSP package, the heat flux was only transmitted through very small solder joints, Most of the heat is concentrated in the central part, which will lead to reduced service life, reduced light quality, and even LED failure.

Ideal Heat Dissipation Model of MCPCB

Usually most of the MCPCB's structure: the metal surface coated with a layer of about 30 microns on the surface of copper. At the same time, the metal surface also has a layer of ceramic particles containing thermal conductivity of the resin layer covered. But too much thermal ceramic particles will affect the performance and reliability of the entire MCPCB.

At the same time, there is always a trade-off between performance and reliability for the thermally conductive media layer.

According to the researchers, the MCPCB needs to reduce the thickness of the dielectric layer for better heat dissipation. Since the thermal resistance (R) is equal to the thickness (L) divided by the thermal conductivity (k) (R = L / (kA)), and the thermal conductivity is determined only by the properties of the medium, the thickness is the only variable.

However, because the dielectric layer due to the limitations of the production process and the use of life considerations can not be unlimited to reduce the thickness, so the researchers need a new material to solve this problem.

How does nano-ceramic become the best solution for MCPCB?

This application claims priority under 35 U.S.C. §119 based on U.S. Provisional Application No. 62/050,488, filed on Sep. 15, 2014 and U.S. Provisional Application No. 62/051,383, filed on Sep. 17, 2014. The disclosure of both U.S. Provisional Application No. 62/050,488 and U.S. Provisional Application No. 62/051,383 are incorporated herein by reference.

FIELD OF INVENTION

The present disclosure contemplates a system and apparatus that cools metal core printed circuit boards. The present disclosure further contemplates a system and method that cools metal core printed circuit boards by circulating a liquid coolant so that it contacts the base metal of the metal core printed circuit board.

BACKGROUND

There have been a number of advancements in the field of thermal management for electronic circuit boards. One innovation has been the Metal Core Printed Circuit Board (“MCPCB”). This approach utilizes a layer of thermal conductive metal, such as copper or aluminum, as the base plate for the circuit board construction. The circuits and components are electrically isolated from the base plate by a thin dielectric layer. The close proximity of the base plate to the electronic circuits and electronic components allows the heat to be dissipated from the source more effectively.

Improvement to the MCPCB approach has included using raised areas on the base plate to protrude through the dielectric layer, providing more thermal attachment options with electronic components, such as soldering or welding. Additional improvements include utilizing thermal transfer vias, made of metals such as copper or aluminum, that allow the transfer of heat through multiple circuit board layers on a single MCPCB.

MCPCBs require effective thermal management systems for the removal of heat from the base plate. Current liquid cooling systems are designed as self-contained cold plates or heat pipes that are attached to circuit boards or electronic components with methods such as soldering, thermal pastes, thermal adhesives, and mechanical systems. Unfortunately, these conventional systems introduce additional material layers between the thermal transfer fluid and circuit board, which can increase thermal resistance and act as a thermal bottleneck.

SUMMARY OF INVENTION

In one example the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component coupled to the base plate of a MCPCB. The direct liquid cooled MCPCB system may cool a MCPCB by coupled to one or more liquid cavity creating components to at least one surface of the MCPCB base plate, allowing a liquid coolant to come into contact with the base plate of the MCPCB for cooling of the MCPCB. The direct liquid cooled MCPCB system may minimize thermal bottlenecks between the electrical components and the cooling fluid while reducing the number of components required in previous liquid cooled electronics systems. This may result in increased thermal dissipation rates, higher possible input temperatures for cooling fluids, lower energy consumption, simplified production methods, and lower production costs.

In some examples, the present disclosure contemplates a direct liquid cooled MCPCB system that may include a liquid cavity creating component and a fastening mechanism(s). The liquid cavity creating component may serve as a heat pipe allowing liquid coolant to flow in a self-contained system or the liquid cavity creating component may have ports to allow liquid coolant to flow into and out of the direct liquid cooled MCPCB system. In the direct liquid cooled MCPCB system, the liquid cavity creating component may be coupled to the MCPCB using the fastening mechanisms. In some example direct liquid cooled MCPCB systems, the liquid cavity creating component may be coupled to a MCPCB cover and the MCPCB cover may be coupled to the MCPCB using another fastening mechanism. In another example the liquid cavity creating component, the MCPCB cover, and the MCPCB may all be coupled together using only the first fastening mechanism. In some examples where ports are utilized in the direct liquid cooled MCPCB system, the liquid cavity creating component may have a multiple liquid ports, where a liquid coolant may flow into the liquid cavity creating component through one liquid port and the liquid coolant may flow out of the liquid cavity creating component through another liquid port. In some examples, the liquid cavity creating component may have an integrated external thermal interface for removing excess heat from the base plate of the MCPCB, while also absorbing or radiating heat from or to the area surrounding the system.

In another example the present disclosure contemplates a method for direct cooling of a MCPCB including coupling a liquid cavity creating component to a MCPCB and circulating a liquid coolant through a cavity between the liquid cavity creating component and the base plate of the MCPCB, such that the liquid coolant comes into direct contact with the base plate of the MCPCB. Example methods for direct cooling of a MCPCB may use a self-contained heat pipe to directly cool the base plate of the MCPCB or the method for direct cooling of a MCPCB may use port(s) to circulate the liquid coolant in the cavity between the liquid cavity creating component and the base plate of the MCPCB.

BRIEF DESCRIPTION OF THE DRAWINGS

The foregoing and other features of the present disclosure will become more fully apparent from the following description, taken in conjunction with the accompanying drawings. Understanding that these drawings depict only several examples in accordance with the disclosure and are therefore, not to be considered limiting of its scope, the disclosure will be described with additional specificity and detail through use of the accompanying drawings.

In the drawings:

FIG. 1 depicts an exploded view of an example direct liquid cooled MCPCB system.

FIG. 2 depicts a cross-sectional side view of an example direct liquid cooled MCPCB system.

FIG. 3 depicts a cross-sectional side view of an example direct liquid cooled MCPCB system with an extended external thermal interface.

FIG. 4 depicts a side perspective view of an example liquid cavity creating component for the direct liquid cooled MCPCB system.

FIG. 5 depicts an example method for direct cooling of a MCPCB.

The researchers found that an electrochemical oxidation process (ECO) could produce a layer of several tens of microns of alumina ceramic (Al2O3) on the aluminum surface, while the alumina ceramics had good strength and relatively low thermal conductivity 7.3 W / mK). However, because the oxide film in the electrochemical oxidation process with aluminum atoms automatically bonded, thereby reducing the thermal resistance between the two materials, but also has a certain structural strength.

At the same time, the researchers combined nano-ceramics with copper cladding, giving the overall thickness of the composite structure a very high total thermal conductivity (about 115 W / mK) at very low temperatures. Therefore, this material is suitable for CSP package requirements.

in conclusion

When designers continue to explore materials that look for suitable CSP packages, they often find that their needs are beyond the existing technology. The heat dissipation problem leads to the birth of nano-ceramic technology, which can fill the gap between the traditional MCPCB and AlN ceramics. Thus driving the designer to introduce a more compact, clean and efficient light source.

6. Very durable.

Aluminum is stronger and more durable than base materials like ceramic and fiberglass. It is very sturdy, and reduces accidental breakages that can occur throughout the manufacturing process, and during handling and everyday use.

7. Lightweight:

Considering its durability, aluminum is very lightweight. It adds strength and resilience to PCBs without adding additional weight.

check our pcb fabrication and pcb assembly services

St. Louis, Missouri, USA – February 14, 2008 – Laird Technologies, a global leader of critical components and systems for advanced electronics and wireless products, today announced its new T-lam™ SS LLD, a metal core printed circuit board (MCPCB) laminate for LED applications. This new environmentally-friendly laminate is designed to keep bright and ultra-bright LED light engines burning brighter, longer and uniformly.
Laird Technologies’ new T-lam SS LLD features a copper circuit layer and aluminum base plate bonded together with the company’s T-lam LLD dielectric. T-lam SS LLD laminates are processed through standard circuit board manufacturing and assembly processes.
Circuit boards designed with T-lam SS LLD allows LED light engines to last longer than competitive materials, and provides a uniform thermal path for consistent output of LED light strips. The dielectric’s unique microstructure allows the assembly to withstand thousands of thermal cycles due to CTE mismatch.
“The LED BLU for LCD TVs and street light production will more than triple in 2008,” said Robert Kranz, global product director. “Laird Technologies has partnered with ITEQ to provide high volume laminate production for these explosive markets.”
T-lam SS LLD is ideal for LED lighting applications, specifically LED BLU for TVs and monitors, as well as light engines for street lights, commercial property safety lighting and general lighting applications.
Laird Technologies has over 15 years experience manufacturing MCPCB laminates. Other products include T-lam 1KA and HTD dielectrics for power and multi-layer applications.
Design samples are available now with mass production beginning in February 2008. The laminate price starts at $0.06 per square inch.

Celcion®, however, incorporates a selective additive deposition process flow—using material only where it's needed. The result is reduced processing steps, less material consumption and simplified bill of materials. Quick and inexpensive design changes can be made. It's an innert glass/metal system - no flammability issues.

Celcion® is compatible with Pb-free solders and fine Au wire bonding. The material is Pb-free, RoHS compliant, REACH compliant.

Heraeus offers with its Celcion® is a thick film based material system, consisting of insulating, conductor, covercoat, and resistor pastes to build circuits directly onto aluminum substrates. All materials can be fired at less than 600 ºC, and it is compatible with 3000, 4000, 5000 and 6000 series aluminum substrates.

Its unique glass system minimizes bowing on aluminum while providing increased thermal conductivity and high dielectric break down strength.

DuPont is putting science to work to help our customers succeed with innovative and sustainable solutions that improve the performance while reducing the manufacturing cost of LED lighting and displays. Examples include OLED materials and process technologies designed to enable cost-effective OLED televisions (TVs) and future OLED lighting applications; DuPont™ CooLam™ thermal substrates for high brightness LED lighting; and DuPont™ Vertak™ optical bonding technologies for more durable LCD and touch screens.

Product Tags: Aluminum PCB for LED Bulb PCB board High Thermal conductivity MCPCB Round MCPCB 7W for Led Bulb Circular lamp PCBA
Quality Aluminum PCB for LED Bulb PCB board High Thermal conductivity MCPCB For LED Bulb Light: for sale

Advantage of Metal core PCB
1.heat dissipation
Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED's light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC's (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC's and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.
2. thermal expansion
Thermal expansion and contraction is the common nature of the substance, different CTE is different in thermal expansion. As its own characterics, aluminum and copper have unique advance than normal FR4, thermal conductivity can be 0.8~3.0 W/c.K.
3. dimensional stability
It is clear that the size of the metal-based printed circuit board more stable than insulating materials. The size change of 2.5 - 3.0% when aluminum core PCB and aluminum sandwich panels was heated from 30 ℃ to 140 - 150 ℃.
4. Less expensive.
Aluminum is indigenous to a variety of climates, so it's easy to mine and refine. That makes it significantly less expensive to mine and refine than other metals. By extension, the manufacturing costs associated with products using aluminum core PCBs are also less expensive. Aluminum core PCBs are also a less expensive alternative to heat sinks.
5. Friendly to the environment.
Aluminum is a non-toxic, recyclable metal. From the manufacturer through to the end consumer, using aluminum in PCBs contributes to a healthy planet.
6. Very durable.
Aluminum is stronger and more durable than base materials like ceramic and fiberglass. It is very sturdy, and reduces accidental breakages that can occur throughout the manufacturing process, and during handling and everyday use.
7. Lightweight:
Considering its durability, aluminum is very lightweight. It adds strength and resilience to PCBs without adding additional weight.

Express PCB		Rigid PCB Rapid Prototype,24 hours
Fr4 PCB		prototype Lower to 15USD !
Rapid Prototype		Fr4 Rigid PCB Rapid Prototype China,

MCPCB		MCPCB Manufacturer China, Shenzhen
Aluminum PCB:		Aluminum Metal Core PCB manufacturing, Fabrication
Aluminum PCB:		single side, double side MCPCB, 0.5-5mm or more

Rogers 4350B		Rogers 4350,Rogers 4003 Manufacturing
Rogers 4350B		Rogers 4350B,4003C PCB Manufacturer
Ro4350B		Rogers High Frequency PCB Manufaturing China

Turnkey Services		Turnkey PCB Assembly Services,
Turnkey services		Print circuit board Manufacturing, Turnkey Services
Turnkey Assembly		Through Hole PCB components wave soldering Assembly

Mining LED lamp Aluminum mcpcb aplication

PCB Supplier Shenzhen, China, PCB Manufacturer, Turnkey services

Express PCB

Rigid PCB Rapid Prototype,24 hours

MCPCB

MCPCB Manufacturer China, Shenzhen

Rogers 4350B

Rogers 4350,Rogers 4003 Manufacturing

Turnkey Services

Turnkey PCB Assembly Services,

Mining LED lamp Aluminum mcpcb aplication