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Underwater LED lamp Aluminum mcpcb aplication

Underwater LED lamp Aluminum mcpcb aplication
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Underwater LED lamp Aluminum mcpcb aplication

  • Underwater LED lamp Aluminum mcpcb aplication
    Three things affect the junction temperature of an LED: drive current, thermal path, and ambient temperature. In general, the higher the drive current, the greater the heat generated at the die. Heat must be moved away from the die in order to maintain expected light output, life, and color. The amount of heat that can be removed depends upon the ambient temperature and the design of the thermal path from the die to the surroundings.

    The typical high-flux LED system is comprised of an emitter, a metal-core printed circuit board (MCPCB), and some form of external heat sink. The emitter houses the die, optics, encapsulant, and heat sink slug (used to draw heat away from the die) and is soldered to the MCPCB. The MCPCB is a special form of circuit board with a dielectric layer (non-conductor of current) bonded to a metal substrate (usually aluminum). The MCPCB is then mechanically attached to an external heat sink which can be a dedicated device integrated into the design of the luminaire or, in some cases, the chassis of the luminaire itself. The size of the heat sink is dependent upon the amount of heat to be dissipated and the material's thermal properties.

    high power LED lamp is a kind of LED lamp beads, relative to small power LED lamp, high power LED lamp of higher power, brightness is brighter, the prices are higher. Small power LED lamp rated current rated current is 20mA, high 20mA, basically can be counted as a great power. General power has: 0.5W, 0.25W, 1W, 3W, 5W, 8W, 10W, etc.. The main units of brightness for LM (LM) and small power unit of luminance is generally MCD (milli candela, 1cd=1000mcd, also is the luminous intensity I.
    1cd=1lm/sr (LM /steradian) =1 candle. Explanation is that the light source in the specified direction of solid angle dΩ within a luminous flux or the light transmission of the flux dΦ the quotient of the two is luminous intensity I (unit: candela, CD). The cover available PC control, high temperature resistant a 135 degrees.
    high power led to product classification:
    currently do for a new green, environmental protection, energy saving light source is widely used in automobile lamps, flashlights, lighting and other places. LED high power is so called, is mainly for small power LED, the current classification standard summed up in three ways: the first kind of
    is based on the size of the power can be divided into 0.5W, 1W, 3W, 5W, 10W....100W range, according to the total power package after the molding product for different.
    second can according to the different packaging process is divided into: large size epoxy resin package, imitation piranha type epoxy resin package, aluminum plate (MCPCB) package, TO package, SMD package, MCPCB power integrated package and so on
    third can according to different degree of attenuation can be divided into low depreciation and non power products low light power products.
    , of course, because of the large power LED parameters of their own more, according to the different parameters will have different classification standards, in this no longer class. LED high power still belong to one of the LED packaging products, is to make the semiconductor lighting to the general lighting in the field of the most important one.
    high power LED product application note matters
    high power LED products and devices in the application process, heat, electrostatic protection, welding has a great influence on its characteristics, the need to attract application side attaches great importance to the customer. cooling
    , high power LED products:
    due to the current semiconductor light-emitting diode chip technology, there is a need to improve the photoelectric conversion efficiency of the LED, especially high power LED, because of its high power, about 60% of the electrical energy into heat energy released (along with the development of semiconductor technology, photoelectric conversion efficiency will gradually improve), which requires client terminal in the application of high power LED products, to do a good job of cooling, to ensure that the work rate of the normal work of the LED products. Cooling
    1. requirement
    appearance and the material: if the finished product sealing requirements is not high, with the outside air environment directly convection occurs, it is recommended with finned aluminum or copper heat sink.
    2. effective cooling table area:
    for 1W high power white LED (the other is basically the same color) our recommended effective heat dissipation for the heat sink surface area sum & Ge; 50-60 square centimeters. For 3W products, recommended heat sink effective heat sink surface area of the total ≥ 150 square centimeters, higher power as the situation and test results increased, as far as possible to ensure that the heat sink temperature is not more than 60.
    3. connection method:
    high power LED substrate and the heat sink connection please ensure the contact surface is smooth, good contact, in order to strengthen the two contact surfaces with suggestions in at the bottom of the LED substrate or bulk thermal film coated on the surface of a layer of heat conducting silicone grease thermal grease thermal conductivity & Ge; 3.0W/m.k, thermal grease requirements of coated evenly and properly, then screw pressure is fixed.
    , high power LED products of electrostatic protection
    LED belongs to semiconductor devices, are more sensitive to electrostatic, especially for white, green, blue, purple led to do to prevent static electricity generation and elimination of electrostatic.

    This application claims benefit to U.S. patent application Ser. No. 13/969,613, filed Aug. 19, 2013, the disclosure of which is hereby incorporated by reference in its entirety.

    The present invention relates to a lighting system, and more particularly to a LED retrofit lighting system for metal halide lamps.

    A metal-halide lamp generates light by passing an electric arc through a gaseous mixture of vaporized mercury and metal halides. The metal halide lamps have high luminous efficiency and produce an intense white light. The metal halide lamps are used in wide area overhead lighting of commercial, industrial, and public spaces, such as parking lots, sports arenas, factories, and retail stores, as well as residential security lighting and automotive headlamps. Approximately 13% of US commercial space uses metal halide lamp for illumination purpose.

    The metal halide lamp though used widely suffers from several disadvantages. A cold metal-halide lamp cannot immediately begin producing its full light capacity and requires approximately 5 minutes coming to full brightness. Furthermore if the power is interrupted, even briefly, the lamp's arc will extinguish, and the high pressure that exists in the hot arc tube will prevent re-striking the arc and therefore metal halide lamps must be allowed to cool for up to 20 minutes before they can be restarted.

    Apart from having moderate life span of approximately 10000 hours and poor lumen maintenance, the metal halide lamps are hazardous and risky to use. The metal halide lamps contain a significant amount of Mercury and are prone to risk of explosion. Over a period of use, arc tube gets weak and since the gases are present at a significantly high pressure, chances for explosion of the Metal halide lamps are always there.

    The most recent evolution in lighting is solid state lighting based on light emitting diode (LED) technology. The light generation principle is similar to what happens in gas discharge lamps, but now the discharge happens in a solid state material: orbit changing electrons cause atoms to get ‘excited’ that subsequently fall back to their natural state thereby releasing its surplus energy in the form of radiation. The advancement in microelectronics technology has led light-emitting-diode (LED) technology to generate lighting and special purpose lighting applications. The LEDs have a large lifespan of 50,000 hrs and are RoHS compliant, i.e. they do not contain mercury or other toxic substances.

    In view of the aforementioned disadvantages associated with the use of metal halide lamps and the technological advancement in LED technology, there is concern rising for replacing metal halide lamps with LED lamps. However the main concern for replacing metal halide lamp with LED lamp is the considerable labor costs involved in the installation, because it will require the opening of the light fixture to disassemble the existing ballast, either it be an electronic one, or a magnetic one. Another concern involved in the replacement of metal halide lamp with LED is the lack of recycle scheme of ballast. Therefore, in view of above constraints, it would be advantageous to have LED retrofit lamp that can directly replace the existing metal halide lamps.

    The present invention provides a retrofit LED lamp that provides a replacement for a Metal Halide lamp driven by a magnetic ballast. The LED lamp is designed to replace the existing metal halide lamp and consists of a circuit that converts the AC waveform generated by the magnetic ballast into the DC waveform suitable for the LEDs.

    In aspects of the present invention, the retrofit LED lamp includes a MCPCB plate mounted with strings of LEDs, a heat sink to dissipate the heat generated by LEDs, a diffuser, a PCB circuit that converts the output from the magnetic ballast into the DC volt required for illuminating LEDs, and a base adaptable to fit into a socket. The PCB circuit includes a bridge rectifier. The retrofit lamp is compatible with existing magnetic ballast and hence does not require the removal of magnetic ballast while replacing the metal halide lamp with the LED lamp.

    The preferred embodiment of the invention will hereinafter be described in conjunction with the appended drawings provided to illustrate and not to limit the scope of the invention, wherein like designation denote like element and in which:

    FIG. 1 illustrates a retrofit LED lamp for replacement of a metal halide lamp driven by a magnetic ballast, in accordance with an embodiment of the present invention.

    FIG. 2A illustrates a schematic representation of an array of LEDs arranged on a MCPCB plate in accordance with an embodiment of the present invention.

    FIG. 2B is a schematic representation LEDs connected in a series to the output of a PCB circuit.

    FIG. 3 shows the schematic illustration of the PCB used in LED retrofit lamp, in accordance with an embodiment of the present invention.

    FIG. 4 illustrates a circuit diagram of a retrofit LED lamp driven by a magnetic ballast, in accordance with an embodiment of the present invention.

    In the following detailed description of embodiments of the invention, numerous specific details are set forth in order to provide a thorough understanding of the embodiment of invention. However, it will be obvious to a person skilled in art that the embodiments of invention may be practiced with or without these specific details. In other instances well known methods, procedures and components have not been described in detail so as to not unnecessarily obscure aspects of the embodiments of the invention.

    Furthermore, it will be clear that the invention is not limited to these embodiments only. Numerous modifications, changes, variations, substitutions and equivalents will be apparent to those skilled in the art, without parting from the spirit and scope of the invention.

    The present invention provides a retrofit LED lamp that provides a replacement for a metal halide lamp driven by a magnetic ballast. The circuit of the retrofit LED lamp includes a bridge rectifier that converts the AC waveform of the magnetic ballast to a single sided waveform to generate DC output to the LED. The frequency of waveform generated by the magnetic ballast is low; Therefore, a traditional rectifier is sufficient to provide the desired DC output required for illumination of LED.

    The retrofit lamp is a LED lamp that provides a replacement to the existing metal halide lamp driven by the magnetic ballast. The retrofit lamps work on the electric current supplied by the magnetic ballast, and hence it can directly replace the existing metal halide lamp without removing the existing ballast.

    FIG. 1 illustrates a retrofit LED lamp for replacement of a metal halide lamp driven by a magnetic ballast, in accordance with an embodiment of the present invention. Referring to FIG. 1, the retrofit lamp includes a plurality of LEDs mounted on a MCPCB plate 104 and is placed in a housing 106 that keeps the plurality of LEDs in a fixed position. The housing 106 can be circular, semi-circular, cylindrical, rectangular, parabolical or a square housing typically used with lamp. The housing 106 provides a means for heat sink for LEDs by providing a path for heat from the LED source to the outside medium. The thermal conductivity of the material of the housing 106 directly affects dissipation of heat through conduction. The housing 106 can be made of aluminum or copper or thermoplastic material or a natural graphite solution that offer better thermal transfer than copper with a lower weight than aluminum. The heat sink made of natural graphite solution has the ability to be formed into complex two dimensional shapes. The housing 106 is covered with a diffuser 102 to emit the light generated by the plurality of LEDs to outside. At the end of housing 106, a ring plate 108 is attached that contains the circuit for converting the AC input from magnetic ballast to DC waveform. A base connector 110 is provided at the bottom of ring plate 108 for fitting the retrofit lamp into the socket.

    In an embodiment of the present invention the pluralities of LEDs are arranged on the MCPCB Metal Core PCB) plate 104. The MCPCB 104 incorporates a base metal material as heat spreader as an integral part of the circuit board. The base metal material can be aluminum alloy or alternatively it incorporates a dielectric polymer layer with high thermal conductivity for lower thermal resistance. The plurality of LEDs is arranged in a linear manner on the MCPCB plate 104 such that the output angle of the emitted light is perpendicular to the surface of MCPCB plate 104. The MCPCB plate 104 is mounted on the housing 106 through a screw. The housing 106 is meant for dissipation of excess heat generated by the lighting of LEDs. The housing 106 acts as a heat sink for the retrofit lamp assembly. The housing 106 is preferably fabricated from aluminum, though it can be fabricated from a material having high thermal conductivity that includes, but are not limited to copper, natural graphite or a thermoplastic material. The housing 106 is designed to have a large surface area for maximum heat dissipation. Alternatively the housing is provided with a number of fine fins. The diffuser 102 is mounted on the housing 106 through a screw for diffusing the light emitted by LED. The diffuser 102 is made of a glass material fabricated in a shape such that the light emitted by the LED is released by the diffuser 102 effectively.

    In an embodiment of the present invention, the retrofit lamp may have a curved diffuser 102. Based on the surface area of the shining surface of the panel, the size and thickness of the optimum light diffuser may be determined. The suitable diffuser 102 may be made from a composite material of polymer and glass fiber, or from a polycarbonate/acrylic material. These materials may be designed with varying amounts of hardness and light refractory characteristics. A sufficient hardness and thickness are required for the structural integrity of the overall panel and refractory characteristics, which are also related to the thickness, are selected in order to cause the light to be transmitted evenly across the diffuser 102. Another advantage of using a sufficiently thick diffuser is that it prevents the LED sources from getting visible. Thus, increasing the aesthetic values and preventing from causing multiple shadows on the object.

    The ring plate 108 is provided at the end of housing 106 such that the ring plate 108 seals the bottom circular end of the housing 106. A PCB is mounted on the ring plate 108, where the said PCB includes a circuit for converting the AC waveform received from the ballast to a DC volt suitable for driving the LEDs. The PCB circuit gets input power from the base connector 110. The base connector 110 fits into the socket meant for metal halide lamp and receives the AC input waveform form the magnetic ballast.

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    Shenzhen Aibixing Industrial Co., Ltd. is a professional PCB manufacturer in China, was established in August 2008. Our plant is located in Shajin town of Shenzhen,only 20 minutes driving to Bao'an Airport and 1 hour to Hongkong port, traffic is very convenient.
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    FIGS. 2A and 2B illustrate a schematic representation of an array of LEDs arranged on a MCPCB plate in accordance with an embodiment of the present invention. Referring to FIG. 2A, the MCPCB plate 104 is mounted with a plurality of LEDs 202 arranged in a linear fashion. The plurality of LEDs 202 is arranged on the MCPCB plate in such a manner that the output angle of the light is in perpendicular orientation to the MCPCB plate. Since the diffuser 102 is fitted over the MCPCB plate 104 with horizontal axis parallel to the MCPCB plate 104, hence the light emitted by the plurality of LEDs 202 will pass through the exit aperture directly. This makes the retrofit lamp a directional emitter and over 80 percent of the light is emitted directly from the fixture and only a small amount of the light is emitted towards the surface. The light emitted towards surface will then be reflected from the surface coated with reflector. The characteristic feature of the retrofit lamp, the lamp emitting light directly from the exit aperture makes the optical efficiency of the retrofit lamp greater than 80 percent. The conventional downlight lamps are only 50 percent optical efficient as the downlight metal halide lamp is omni-directional emitter and only a small portion of light is emitted directly from the exit aperture and a large portion of light is emitted after reflection from the lamp surface. FIG. 2B shows a plurality of LEDS 202 connected in a series to the output of PCB circuit.

    1. electrostatic:
    1 friction: in daily life, and any two different material object contact and separation, can produce static electricity, and static electricity of the most common method is the triboelectrification. The better the insulation of the material, the easier it is to generate electricity. In addition, any two different substances of the object after contact and then separated, also can produce static electricity. Induction of the
    : for conductive materials, due to the electron energy in the free flow of its surface, as will be placed in an electric field in, because same-sex repulsion, opposites attract, the positive and negative ions will be transferred, on its surface will produce charge.
    conduction: for conductive materials, the electron energy in its surface free flow, such as contact with charged objects, the charge transfer will occur. Damage to the LED electrostatic
    due to instantaneous electric fields generated by heat, the LED locally injured and performance as the leakage current increases rapidly and can still work, but lower brightness, life impaired.
    because of the electric field or current damage to the LED insulation layer, so that the device can not work (complete destruction), the performance of dead lights.

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    Cambridge Nanotherm delivers ‘ground-breaking’ technology in partnership with Optocap to LED customer.

    The company, in partnership with microelectronic and optoelectronics packaging design and assembly company, Optocap, have delivered the first CoH module. According to Optocap, the technology was selected on the basis of its thermal performance. It also claims that it means a reduced bill of materials, simplified supplier management and easier assembly for customers.

    The core IP is a process for converting aluminium into alumina. It allows the surface of any aluminium object to be converted into a dielectric layer. An extruded heatsink or heat pipe can be coated and then metallised with the end user’s circuit design. The technology enabled Optocap to use its advanced manufacturing processes, allowing direct assembly of die and surface mount components onto the heatsink, creating an integrated module.

    For LED lighting customers using conventional PCB materials and heatsinks, the advantages are three-fold: firstly, a cost reduction is seen by the removal of both the MCPCB and thermal interface material components; secondly, the removal of these layers gives the most efficient thermal path between component and heatsink. Finally, as a result of minimising thermal resistance, denser component layouts can be realised. For those using thick-film or thin-film metallised alumina and aluminium nitride ceramic heatsinks, the cost reduction is even more significant, while bulk thermal performance of the aluminium heatsink matches one made from aluminium nitride.

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    The better Direct Thermal Path (DTP) Copper MCPCB provides excellent heat dissipation to ensure the best performance. And the body is made from high strength aerospace aluminum alloy with premium type HAIII hard-anodized anti-abrasive finish.

    Stainless Reversible Clips
    With high quality detachable stainless steel reversible clip, you can put it in pocket or reverse to fasten to hat as a hat lamp.

    Heat management and an awareness of the operating environment are critical considerations to the design and application of LED luminaires for general illumination. Successful products will use superior heat sink designs to dissipate heat, and minimize Tj. Keeping the Tj as low as possible and within manufacturer specifications is necessary in order to maximize the performance potential of LEDs.
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