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Majority of people is familiar with infrared camera. Infrared cameras are the most widely used for video surveillance systems, especially for residential security. Now you will find out numerous of security camera called IR LED Array Cameras. What's the IR LED Array Camera? The security camera come with IR LED Array board, we call it IR LED Array Camera.

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The three thermally conductive pastes above all use a unique mixture of advanced poly-synthetic oils that work to provide three different functional phases. These three phases make Arctic Silver’s products stand out as it makes application much easier and maximizes cooling efficiency over the life of your LED(s).

The first stage starts when the thermal material first comes from the syringe. The consistency is thin and engineered for easy application, making spreading it around on your heatsink a breeze. This initial phase has a cure time of about 5 minutes, you should plan on spreading it and placing your LED in under that time so it doesn’t harden before you have the LED in place. The second phase starts after you place your LED star and during the LEDs initial use. This stage allows for the thermal paste to thin even more, filling in the microscopic valleys where the surface is not covered. This stage ensures that there is the best possible contact between the heatsink and LED. In the next 50-200 hours of use, the material will thicken into its final consistency that is designed for long-term stability. This is the stage that adhesives will harden even more and make the best possible bond.

Thermal Conductivity

This is what ultimately matters most when discussing thermal adhesives and compounds. It is important to know how the epoxy or compound conducts heat. Once we know the rate that the material will pass heat through, we can compare the options and find the best. In the opening of the post I mentioned that many people will try to use lower quality product or thermal tape for their applications. This isn’t necessarily wrong, especially if you are running at lower drive currents. LED tape can be great for LEDs running up to about 700mA, but once you go up from there I would recommend using adhesives instead. The tape might be much easier in terms of setting up and replacing LEDs in the future, but it lacks in how well it conducts heat.

Thermal conductivity is measured in Watts per meter Kelvin. Broken down, it is the number of heat units (Watts) that flow during a unit of time through a sectional area (square meter) when the temperature falls a degree (Kelvin) per unit length (meter) of its path. Now I could try to explain this for hours, but in hopes of not confusing you (and myself for that matter), it is basically the rate at which heat can pass through material. Higher numbers represent better heat transfer ability as this means more Watts can move quicker through the same amount of contact area.

The thermal conductivity of air is .024 W/m-K…not very impressive, which is why you need a proper heatsink and a thermally conductive paste for your LEDs. Thermal tape will vary by type but tends to be around .2-.25 W/m-K, so about 10 times better than air. This isn’t bad for some smaller applications but if I am doing a large project and want to guarantee I’m not going to have to go back and fix my LEDs months in the future, I’m going with one of the Arctic Silver products.

There is no thermal conductivity data that I could find for Arctic Alumina adhesive, but the company makes an Alumina compound that is >4 W/m-K and I’m going to guess the adhesive sticks around around that as well, so this adhesive is about 75-100x better than air.

The silver based products are the best heat conductors. If you need an adhesive, the Arctic Silver Thermal Adhesive is advertised as >7.5W/m-K (300x better than air). The Arctic Silver 5 compound boasts the best thermal conductivity. Remember this can only be used if you have another way of mounting the LED, as with screws or an external mounting system. The compound at a .001 inch thick layer calculates to 8.89 W/m-K…around 340x better than air!!

Conclusion

By looking at the thermal properties, it is easy to see that Arctic Silver products are far more efficient at moving heat than other options. For LEDs, the lower the temperature, the brighter and longer they will run. LEDs will degrade much slower at lower operating temperatures, meaning it could mean years of difference in run times if you decide to go with Arctic Silver Thermal Adhesives or Compounds. If I am using High Power LEDs, it is a no brainer to me to use these products to maximize thermal transfer and ultimately the quality of light and lifespan of these amazing light sources.

Alternative Uses for Thermal Adhesive and Compound

Here at LEDSupply our focus is obviously on LED components and really anything that can make the setup and use of LEDs easier. That is why we focus on thermal adhesives and compounds in terms of their uses with light emitting diodes. However, there are actually many uses for thermal adhesives and compounds.

The base plane of the fixture 102 supports each element of the solid state lighting apparatus 100. A metal core Printed Circuit Board (MCPCB) 118 mounted on the central mounting surface of the fixture 102, optionally a coated layer of copper 168 (not shown in the figures) sandwiched between the primary heat sink 102 and MCPCB 118 and Two high intensity solid state light emitting sources 120 are mounted on the MCPCB 118 and edges thereof secured thereon the central mounting surface 104 and the said solid state light emitting sources 120 can be selected from the group of low power or high power LEDs including LED, OLED, and PLED, wherein protective transparent sheet 124 or lens 122 (not shown in figures) are mounted on the high intensity solid state light emitting sources 120 for preventing the scattering of the light in unnecessary areas and thereby directing the light in to desired area.

Two MCPCBs 118 mounted on the left and right side of the mounting surfaces 104 a and 104 b and an array of solid state light emitting source 120 mounted on the MCPCBs 118. Two protective transparent sheets 124 are employed for covering the solid state light emitting sources 120 for preventing the insects entering the lighting apparatus, According to one embodiment of the invention, the material of the protective transparent sheet 124 can be selected from glass and/or clear polycarbonate.

The above said MCPCB 118 comprises of three layers namely bottom layer, middle (insulation) layer and top layer (not shown in the figures). The bottom layer is made up of at least one thermally conductive material selected from the set of aluminum, iron, steel, copper or combinations or alloys thereof. The bottom layer is connected with the mounting surface 104 of the fixture 102 with a thermal interface layer. The middle layer is made of electrically insulating material and used to conduct the heat from the top layer of the MCPCB 118 and not allowing conduction of electricity from the top layer to bottom layer. The top layer is made up of copper or any other metal having better heat and electrical conductivity than copper e.g. Gold plated copper. At least one solid state light emitting source 120 mounted thereon the top layer of the MCPCB 118.

Two heat dissipating panels 126 (not shown in the figures) acting as secondary heat sink are mounted (left and right side, each one respectively) thereon the reverse side of fixture 102 wherein the secondary heat sink 126 is made of at least one thermally conductive material selected from the set of aluminum, iron, steel, copper or combinations or alloys thereof. Optionally one or more slit 108, hole 110 or fin 112, selectively punched on the mounting surface 104 of the fixture 102 for achieving additional heat dissipation and minimizing the resistance to wind. The said slit 108, hole 110 or fin 112 can be any shape based on the requirements.

The secondary heat sink 126 on the top-side heat dissipating area is covered by means of a metal covering 128 affixed thereon the fixture 102 protecting the elements underneath and wherein the metal covering 128 prevents coating of upper heat dissipating area from bird droppings and any other droppings, these droppings reduces heat dissipation ability of the top side heat dissipating area of the fixture 102.

A housing 114 secured thereon the distal ends of the fixture 102. A power supply units 116 are mounted inside said housing 114, the solid state lighting apparatus 100 is easily serviceable, wherein the power supply units are independent components and can be replaced in case of failures. The power supply units 116 electrically connected to each of solid state light emitting sources 120 by means of connecting wires extending from the power supply units 116 to the solid state light emitting source 120. The said power supply unit 116 achieves a power factor >0.98 thereby reducing the reactive power. The required DC or AC voltage can be generated from AC or DC input power. The AC/DC input power supply can be converted into required DC power supply for operation of the solid state light emitting sources 120 by using AC to DC converter, or DC to DC converter as per requirement.

Further solid state lighting apparatus 100 is installed with a photo sensor means 134 and/or motion sensor means 172 (not shown in the figures) when used for public lighting purposes, a photo sensor means 134 and/or motion sensor means 172 coupled with AC or DC input power or power supply unit, the said photo sensor means 134 and motion sensor means 172 are configured to selectively control the power input to the solid state lighting apparatus 100, wherein the photo sensor means 134 can be Day light sensor or High Accuracy Ambient Light Sensor.

The motion sensor means 172 can be worked in two ways for saving the energy, one way operation based on sensing the motion wherein motion sensor means 172 is configured to control the power input to switch ON the solid state lighting apparatus 100. If there is no motion is sensed by the motion sensor means 172 thereby configured to control the power input to switch OFF the solid state lighting apparatus 100. Second way of operation is based on sensing the motion, wherein upon detection of motion the motion sensor means 172 is configured to allow 100% power input to the solid state light emitting sources 120 to improve light intensity by 100%. If there is no motion sensed by the motion sensor means 172 the power input to the solid state light emitting sources 120 is reduced to reduce the light intensity up to 90%.

According to one embodiment of the invention, solid state lighting apparatus 100 is installed with a timer 174 (not shown in the figures) coupled with AC or DC input power, the said timer means configured to selectively control the power input to the solid state lighting apparatus. The timer 174 can be worked in n number of ways to selectively control the power supply of the solid state lighting apparatus 100 for switching ON and OFF and controlling light intensity by controlling the power supplied to the apparatus 100.

An apparatus engagement means 136 with two holes in c-channel 138 providing the ability for angular adjustment to the fixture 102 so as to adjust the photometry of the light along the width of the road. Further, the said apparatus 100 enables to achieve ingress protection standards wherein the standards can be IP65, IP66, and IP67, etc.

FIG. 4 illustrates a top view of solid state lighting apparatus which is used for High Bay Light application according to another exemplary embodiment of the invention. The solid state lighting apparatus 200 having five separate fixtures 202 connected to form one fixture 200 using connecting means 256 a, 256 b with help of the screws 250. The fixture 202 is made of at least one thermally conductive material and the thermally conductive material is selected from the set of aluminum, iron, steel, copper, or combinations or alloys thereof.

Each fixture having one or more slits 208 (not shown in figure) or fins 212, selectively punched on mounting surface 204 of the each fixture 202 for achieving additional heat dissipation and minimizing the resistance to wind. The slit 208 or fin 212 can be any shape based on the requirements.

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Innovative Illumination with LEDs The 6th VDI conference about Innovative Illumination with LEDs took place in Düsseldorf, Germany on the 18th and 19th of November, VDI is the association of German engineers and the conference covered the actual market as well as technology trends in the LED lighting domain, also focusing on white LED developments. Leading experts from LED manufacturers and from lighting producers attended the two-day conference. The white light LED applications show the highest market growth rate nowadays, but with $325M USD (2007), only about 2% of the worldwide illumination business is covered by LED solutions. The market potential is very high, especially when considering the legal relegation of the inefficient incandescent lamps. LED and lighting module manufacturers continuously improve white LED parameters. The reduction of binning classes is one big target. Besides the reduction of phosphor mixture tolerances, manufacturers selectively combine LED dies with a suitable phosphor carrier in their production process, to reach accurate CCT areas. In high-end applications like aerospace and automotive, the quality of the white light from LEDs is not sufficient yet. Even with binning optimization processes, color problems occur in combination with secondary optics because of unequal spectral distributions. The efficiency values are continuously improving. LEDs with more than 100lm/W are available on the market in high volume, but the manufacturers pointed out that efficiency and CRI/CCT will remain a major contradiction in the development of white LEDs. The further improvement will go faster with high-current, high-power LEDs compared to the development steps in the lower-current area. But the efficiency values will also come into saturation within the next few years. Efficiency values of about CRI 80 can be seen as a next target value they are facing, but a lot of work has to be done to reach this goal. The VDI conference clearly showed that the LED lighting is entering the illumination market and comes only from niche applications. Multi-Chip LED solutions for replacing the incandescent lamps or LED lighting modules, in which the LED technology is embedded in a system are forcing this fast development. On the other hand, there is still confusion in the market based on incomparable or insufficient figures from some LED manufacturers. This concerns the need for common measurement standards, but often missing data, like the lifetime of LEDs, regarding the reduction of the lumen output and the shift in color temperature or spectrum, should be included in datasheets. In addition to the quality improvements of LEDs we should not forget to reduce the system costs, because today the pay-back time with a range from three to eight years is still too long for a real market breakthrough. Innovative illumination with LEDs requires a system in which the LEDs, the primary and secondary optics, the electronic driver and supplies, the thermal management devices and last, but not least, the mechanics with its design, are carefully chosen. More and more the different system-components merge together, building complete innovative sub-units of lighting systems with the advantage of easy handling for the OEMs. The development of these sub-units requires multi-domain approaches and therefore multi-domain tools to model and verify such LED lighting systems. The November/December 2008 LED professional Review (LpR) issue highlights LED simulation and measurement topics showing how these methods can be applied to modern LED lighting systems. We would be delighted to receive your feedback about LpR or tell us how we can improve our services. You are also welcome to contribute your own editorials. Yours Sincerely, Siegfried Luger Publisher LED professional Review Nov/Dec 2008 page 1

4 Imprint LED professional Review (LpR) ISSN X Publisher Luger Research e.u. Institute for Innovation & Technology dep LED professional Rhombergs Fabrik A 6850 Dornbirn, Austria / Europe phone fax Publishing Editors Siegfried Luger Arno Grabher-Meyer Chrystyna Lucyk Account Manager Silvia Girardelli Front-page picture GaN based UV-LED testing FBH/schurian.com Copyrights Luger Research e.u. The editors make every reasonable effort to verify the information published, but Luger Research e.u. assumes no responsibility for the validity of any manufacturers, non profit organisations or individuals claims or statements. Luger Research e.u. does not assume and hereby disclaims any liability to any person for any loss or damage caused by errors or omissions in the material contained herein, regardless of whether such errors result from negligence, accident or any other cause whatsoever. You may not copy, reproduce, republish, download, post, broadcast, transmit, make available to the public, or otherwise use of LED professional Review (LpR) content without the prior written permission from Luger Research e.u. Institute for Innovation & Technology, Austria. LED professional Review (LpR) - Subsription LpR Digital Magazine free version pdf download view only, low resolution private use LpR Digital Magazine full version annual subscription pdf download pictures and graphs in high resolutions, printable 6 issues access to all previous issues commercial use Euro LpR Printed Magazine annual subscription 6 issues Euro Send to: Next LpR Issue - Jan/Feb2009 LED Electronics LED professional Review Nov/Dec 2008 page 2

5 Content Advertising Index EVERLIGHT p C2 Editorial Imprint Product News Research News IP News Correction p1 p2 p5 p10 p12 p12 OPTICLAL RESEARCH p 4 OSRAM p 13 INSTRUMENT SYSTEMS p 19 SAMSUNG p 21 ROAL LIVING ENERGY p 33 POWER VECTOR p 33 EDISON p 35 LED TAIWAN 2009 p 39 LED CHINA 2009 p 43 Characterization INTERNATIONAL RECTIFIER p C3 LED Lighting Technology Fundamentals and Measurement Guidelines by M. Nisa Khan, Ph.D., LED Lighting Technologies p14 TRIDONIC.ATCO p C4 CIE 1964 Colorimetric Observer Chart Improves White Light Quality by Peter Pachlar, Tridonic Atco Optoelectronics p16 White Light LEDs Importance of Accepted Measurement Standards by Dr. Thomas Nägele; Instrument Systems GmbH p22 The Role of Miniature Spectrometers for LED Measurements by Jorge Macho, Ocean Optics p26 Technology LED Encapsulant Epoxy Curing Optimization by Bit Tie Chan, Avago Technologies p30 Optics LED Source Modeling Method Evaluations by Mark Jongewaard, LTI Optics and Kurt Wilcox, Ruud Lighting p34 Simulation and Optimization of Optical Systems by Dr. Norbert Harendt, IB/E OPTICS and Christoph Gerhard, LINOS Photonics p40 Thermal Management Simulating Device Thermal Performance Using PLECS by Dr. John Schönberger, Plexim GmbH p44 Annual LED professional Review (LpR) Article Index 2008 p46 LED professional Review Nov/Dec 2008 page 3

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The above said fixtures 202 is made of at least one thermally conductive sheet metal, wherein the thermally conductive sheet metal is selected from the set of aluminum, iron, steel, copper, or combinations or alloys thereof. The said fixture manufactured by computerized numerically controlled (CNC) process; the said fixture is characterized in having;

i. four separate fixtures 202 connected to form one fixture 202, thereby achieving independent heat management system for each of the four fixtures as well as the central fixture;
ii. the entire body of the fixture 202 acting as primary heat sink, wherein the fixture is designed in a manner, such that the heat dissipation is maximum in x, y coordinates laterally of the fixture due to thickness (z-axis) of the fixture 202 in the range from 0.5 to 6 mm;
iii. anodization for preventing corrosion and scratches thereby increasing thermal conductivity;
iv. optimized design enabling maximum light spread in the required area;
v. One or more plane of the fixture 202 including the base plane of the fixture can adjustably be inclined into desired angle to achieve desired photometry; the said angle can be in the range from 0-360 degrees.
vi. light spread/throw optionally will be achieved with combination of different lenses placed on the solid state light emitting sources

One of the most common uses is to transfer heat from CPU cores to heatsinks within a computer. This is done in pretty much the exact way you would apply the thermal paste to LEDs. The compound or adhesive will increase contact area by filling up the small valleys not filled in between the processor core and the heatsink. Processors will always run hot with use so providing an adequate thermal path is just as important for computers as it is for LEDs! CPU manufacturers usually will include thermal paste with their products, like Intel, but other than what they send you with the chip, there is none available commercially. There are many off brand names and other options but Arctic Silver is the best option available to the public.

Lastly, for all you gamers out there, this product could save that old Xbox of yours! The ‘Red Ring of Death’ has long been a notorious end sign for your consoles life. Now with this compound, there is actually a method to saving your system and keeping it running! Thermal Adhesives and compounds have more uses than you may have thought; they will help transfer heat in a variety of applications, and for heat sensitive applications this can mean all the difference.

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Difference between Infrared (IR) LED and Infrared LED Array

Infrared LED and Infrared LED Array are the device that can emit the active infrared ray. Infrared LED Array with more wide emitting angle (can reach up to 180 degree) than the traditional infrared LED. Traditional infrared LED only can emit the active infrared ray in a narrow angle (typically 40-50 degree). When the security camera with Infrared LED array, the emitted infrared will cover the whole surveillance area, that means the Infrared LED Array camera can see the whole area at darkness environment (such as at night).

In addition, the Infrared LED Array with high brightness. The output power of single Infrared Array is 1-30W, the brightness is about several hundred times of the output of the conventional single infrared LED (~ 15mW), as a result, the Infrared LED Array camera's night vision can reach more far away.

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Main article: List of LED failure modes
Solid-state devices such as LEDs are subject to very limited wear and tear if operated at low currents and at low temperatures. Typical lifetimes quoted are 25,000 to 100,000 hours, but heat and current settings can extend or shorten this time significantly.[69]

The most common symptom of LED (and diode laser) failure is the gradual lowering of light output and loss of efficiency. Sudden failures, although rare, can also occur. Early red LEDs were notable for their short service life. With the development of high-power LEDs, the devices are subjected to higher junction temperatures and higher current densities than traditional devices. This causes stress on the material and may cause early light-output degradation. To quantify useful lifetime in a standardized manner, some suggest using L70 or L50, which are runtimes (typically in thousands of hours) at which a given LED reaches 70% and 50% of initial light output, respectively.[70]

Whereas in most previous sources of light (incandescent lamps, discharge lamps, and those that burn combustible fuel, e.g. candles and oil lamps) the light results from heat, LEDs only operate if they are kept cool enough. The manufacturer commonly specifies a maximum junction temperature of 125 or 150 °C, and lower temperatures are advisable in the interests of long life. At these temperatures, relatively little heat is lost by radiation, which means that the light beam generated by an LED is cool.

The waste heat in a high-power LED (which as of 2015 can be less than half the power that it consumes) is conveyed by conduction through the substrate and package of the LED to a heat sink, which gives up the heat to the ambient air by convection. Careful thermal design is, therefore, essential, taking into account the thermal resistances of the LED’s package, the heat sink and the interface between the two. Medium-power LEDs are often designed to solder directly to a printed circuit board that contains a thermally conductive metal layer. High-power LEDs are packaged in large-area ceramic packages that attach to a metal heat sink—the interface being a material with high thermal conductivity (thermal grease, phase-change material, thermally conductive pad, or thermal adhesive).

If an LED-based lamp is installed in an unventilated luminaire, or a luminaire is located in an environment that does not have free air circulation, the LED is likely to overheat, resulting in reduced life or early catastrophic failure. Thermal design is often based on an ambient temperature of 25 °C (77 °F). LEDs used in outdoor applications, such as traffic signals or in-pavement signal lights, and in climates where the temperature within the light fixture gets very high, could experience reduced output or even failure.[71]

Since LED efficacy is higher at low temperatures, LED technology is well suited for supermarket freezer lighting.[72][73][74] Because LEDs produce less waste heat than incandescent lamps, their use in freezers can save on refrigeration costs as well. However, they may be more susceptible to frost and snow buildup than incandescent lamps,[71] so some LED lighting systems have been designed with an added heating circuit. Additionally, research has developed heat sink technologies that transfer heat produced within the junction to appropriate areas of the light fixture.[75]

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